Stacked PCB Assembly Using Dual-Melting-Point Reflow Soldering
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Solution Overview
Problem
The existing methods for stacking printed circuit boards (PCBs) are complex and require multiple independent processes, including solder paste printing and reflow soldering on separate boards, necessitating numerous assembly lines and machines, which complicates the overall process.
Innovation Solution
A method and system for stacking PCBs that involves printing solder paste on both the lower and upper baseboards, placing components, and performing reflow soldering in a sequential manner to simplify the assembly process, using a single reflow soldering machine with adjusted temperatures for different solder pastes to reduce equipment usage and streamline the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If independent processes for solder paste printing and reflow soldering are performed on upper board and pinboard separately, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent combines the upper board and pinboard assembly into a single integrated structure that is mounted together on the lower board in one reflow soldering process. This merging of previously separate assembly operations reduces process complexity while maintaining soldering quality through unified thermal processing and alignment.
2Manufacturing precision
If multiple assembly lines with SMT and assembly machines are used, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple assembly operations into a single assembly line process. The upper board and pinboard are pre-assembled together as one unit, which then undergoes one reflow soldering cycle on the lower board, eliminating the need for multiple separate SMT lines and assembly machines.
Solution Approach 2:
The single reflow soldering machine performs multiple functions: it simultaneously solderes the upper board components, pinboard components, and the combined assembly to the lower board, replacing what previously required multiple specialized machines.
3Manufacturing precision
If separate reflow soldering processes are performed for upper board and pinboard, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
By combining the upper board and pinboard into a single assembly unit that undergoes one reflow soldering process, the patent eliminates the sequential nature of separate soldering operations. This parallelization of assembly operations within a single process cycle increases productivity while maintaining soldering consistency through unified thermal control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the PCB stacking process by reducing the number of assembly lines and machines needed, making the assembly process more efficient and faster, while allowing for easier maintenance and disassembly of the printed circuit board.
Implementation Method 1
performing reflow soldering on the lower baseboard with the components and the upper baseboard
Data Source
AI summary
A method and a system for stacking printed circuit boards includes providing a lower baseboard, a pinboard, and an upper baseboard; printing a first solder paste on the lower baseboard; placing a placement component on the lower baseboard; placing the pinboard on the lower baseboard; reflow soldering the lower baseboard with the placement component and the pinboard and forming a first assembly; printing the first solder paste and a second solder paste on the upper baseboard; placing the placement component on the upper baseboard and the first assembly on the upper baseboard; and reflow soldering the upper baseboard with the placement component and the first assembly and forming a printed circuit board; a melting point of the first solder paste is higher than a melting point of the second solder paste.