Stacked PCB Transmission Line Layout for High-Frequency Signal Isolation

The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. Multiple conductive wiring layers are arranged vertically across multiple circuit boards, allowing power lines, signal lines, and control lines to be separated in the vertical dimension while maintaining compact horizontal footprint. This dimensional change enables reduced transmission line width while preserving signal integrity through proper layer stacking and grounding.

The patent divides the conductive wiring into multiple separate layers, with each layer containing specific types of lines (power, signal, control, or ground). This segmentation isolates potentially interfering lines from each other by placing them on different vertical levels. For example, signal lines are separated from power and control lines through intermediate ground layers, eliminating direct horizontal proximity while maintaining manufacturing feasibility through standardized multi-layer PCB processes.

The patent implements a nested hierarchical structure where multiple circuit boards are stacked and bonded together, with each board containing specific conductive wiring layers. The ground layers on adjacent boards are electrically connected through vias and bonding interfaces, creating a nested shielding configuration. This nested approach reduces the horizontal area while managing complexity through modular assembly and standardized interconnection methods.