Stacked PCB Module Layout With Multi-Path Signal Connections
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Solution Overview
Problem
The limited signal transmission path between stacked boards in a stacked PCB structure, resulting from reliance on interposer connectors, hinders the improvement of spatial utilization and component layout efficiency in electronic devices.
Innovation Solution
A double-sided disposing-type electronic component module is introduced, which includes a first and a second circuit board with additional contact points and connection members, such as CU pillars or solder bumps, to establish multiple signal transmission paths alongside the interposer connector, enhancing spatial arrangement efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a stacked PCB structure with interposer connector is used to increase arrangement efficiency, then spatial utilization is improved, but signal transmission paths are limited
Solution Approach 1:
The electronic component module is segmented into multiple independent circuit boards (first circuit board, second circuit board, third circuit board) that can be stacked in different configurations. This segmentation allows multiple signal transmission paths to be established between the first and second circuit boards, either directly or through the third circuit board, thereby resolving the limitation of single-path transmission while maintaining compact spatial utilization.
Solution Approach 2:
The patent introduces a third circuit board positioned between the first and second circuit boards in the stacking direction, creating additional signal transmission dimensions. Signals can now transmit through multiple routes: directly from first to second circuit board, or indirectly through the third circuit board, effectively adding another dimension to signal transmission paths without increasing the footprint area.
2Ease of manufacture
If components are arranged on single-sided PCBs, then manufacturing is simple, but spatial arrangement efficiency is limited
Solution Approach 1:
The patent transitions from single-sided component arrangement to multi-layer stacked board structure. Electronic components are disposed on both the front and rear surfaces of multiple circuit boards in the stacking direction, effectively utilizing the third dimension (height/depth) for component placement. This maintains manufacturing simplicity through standardized SMD processes while dramatically improving spatial arrangement efficiency by enabling double-sided disposing-type configurations.
Data Source
AI summary
An electronic device includes: a first circuit board; at least one electronic component module disposed on the first circuit board; one first connection member disposed on the first circuit board; and a second circuit board stacked on the one first connection member, wherein the one electronic component module includes: a third circuit board facing the first circuit board; one first electronic component disposed on the third circuit board; a fourth circuit board facing the second circuit board; one second electronic component disposed on the fourth circuit board; a first contact point disposed on the third circuit board and configured to electrically connect the first circuit board with the third circuit board; and a second contact point disposed on the fourth circuit board and configured to electrically connect the second circuit board with the fourth circuit board.