Stacked PCB Assembly Layout for Warpage Direction Alignment
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Solution Overview
Problem
The challenge of controlling warpage directions of multiple printed circuit boards in a printed circuit board assembly to prevent defects during high-temperature processes, particularly in stacked configurations, is addressed by adjusting the copper area ratio for each layer, which is constrained by design limitations.
Innovation Solution
The use of a conductive pattern in the protrusion parts of the printed circuit boards to control warpage directions, ensuring similar or identical warpage directions across multiple boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the ratio of copper area for each layer is adjusted to control warpage directions, then warpage control is improved, but design flexibility is reduced due to design constraints
Solution Approach 1:
The patent applies local quality by forming conductive patterns specifically in protrusion parts of the printed circuit board rather than uniformly across the entire board. This localized approach allows warpage control in critical areas without constraining the overall design flexibility of the PCB layout.
Solution Approach 2:
The patent segments the PCB into a main body and protrusion parts, applying different design considerations to each. The conductive patterns are specifically placed in the protrusion parts, allowing independent optimization of warpage control in these areas without affecting the overall design flexibility of the main board.
2Quantity of substance
If multiple printed circuit boards are stacked to increase component integration, then component density is improved, but warpage-related defects increase due to cumulative warpage effects
Solution Approach 1:
The patent addresses warpage control locally in protrusion parts of each PCB in the stack. By forming conductive patterns specifically in these protrusion parts, the warpage of each individual board is controlled, which in turn prevents cumulative warpage effects in the stacked configuration, maintaining reliability while achieving high component integration.
3Manufacturing precision
If conductive patterns are formed in protrusion parts to control warpage, then warpage direction control is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive patterns are formed locally only in the protrusion parts of the PCB where warpage control is most critical. This localized approach achieves effective warpage direction control while minimizing the additional manufacturing complexity compared to applying conductive patterns across the entire board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the mountability and reliability of electronic components by aligning warpage directions, reducing defects and improving assembly consistency.
Implementation Method 1
In a process of mounting the electronic components on the printed circuit board through a reflow process or the like of the surface mount technology, the printed circuit board can be in a high temperature state, and in this high temperature state, a warpage phenomenon can occur
Data Source
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AI summary
Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part which is extended in a first direction from a part of the first part and in which a length of the second part in a second direction perpendicular to the first direction is smaller than a length in the second direction of the first part, and the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other. Additionally, various other embodiments identified through this document are feasible.