Stacked PCB Warpage Control via Reinforcing Structure

The substrate is divided into multiple separate printed circuit boards stacked together, with each board having fewer layers and smaller size requirements. This segmentation allows each individual board to be manufactured more easily and with higher yield, while the stacked configuration achieves the required overall performance and layer count.

Instead of increasing the number of layers in a single substrate vertically, the invention transitions to a three-dimensional stacked configuration of multiple substrates. This dimensional change allows the system to achieve high layer equivalence while maintaining simpler individual substrate designs that are easier and more cost-effective to manufacture.

The large, highly integrated substrate is segmented into multiple smaller printed circuit boards. Each smaller board has reduced warpage tendency due to its smaller size and fewer layers, while the stacked assembly achieves the required integration through increased component count and inter-board connectivity.

The reinforcing structure is positioned beneath the stacked printed circuit boards to provide counterbalancing support. This counterweight effect compensates for the warpage forces generated by the stacked boards, maintaining flatness and stability of the overall assembly despite the increased layering and integration.