Stacked PDN Package Structure for Grounding and Compact Reliability

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Solution Overview

Problem

Conventional electronic packages and manufacturing methods result in excessive costs, decreased reliability, and large package sizes with relatively low performance.

Innovation Solution

The proposed solution involves a semiconductor device configuration in power distribution network (PDN) packages, where a substrate with conductive structures provides a grounded and powered path, and network structures with covers and interconnects are used to connect electronic components effectively, including a shield for grounding and decoupling, resulting in a cost-effective and improved performance implementation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electronic packages and manufacturing methods are used, then manufacturing simplicity is maintained, but cost increases and reliability decreases

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The package structure is divided into distinct functional layers including substrate, encapsulant, network structures with covers, and shield structures. Each layer performs specific functions (power distribution, protection, grounding, shielding) allowing independent optimization and manufacturing of each component before assembly, improving reliability while maintaining manufacturing feasibility

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements nested structures where network covers are positioned over encapsulants, shield structures are placed over network structures, and multiple layers are stacked vertically. This nested arrangement compactly integrates multiple functions (power distribution, protection, grounding, EMI shielding) within a small volume, achieving high reliability without excessive complexity in manufacturing

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If conventional electronic packages are used, then manufacturing process simplicity is maintained, but performance decreases

Engineering Contradiction:

ImproveperformanceVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The package structure integrates multiple functions into a unified design: the substrate provides both mechanical support and power distribution paths, the encapsulant offers both physical protection and electrical isolation, the network structures deliver both power and ground connections, and the shield structures provide both EMI shielding and structural integrity. This multi-functionality improves performance without proportionally increasing complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent transitions from planar package layouts to three-dimensional stacked architectures. Network structures and shield structures are positioned at different vertical levels above the substrate, creating a multi-layer configuration. This vertical dimensionality allows efficient routing of power and ground paths in three dimensions, improving electrical performance and signal integrity while maintaining a compact footprint

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If conventional electronic packages are used, then manufacturing simplicity is maintained, but package size increases

Engineering Contradiction:

ImproveperformanceVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent employs nested structures where network covers are positioned over encapsulants, shield structures are placed over network structures, and multiple layers are stacked vertically. This nested arrangement compactly integrates multiple functions (power distribution, protection, grounding, EMI shielding) within a small volume, achieving high reliability without excessive complexity in manufacturing

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240006279A1Electronic devices and methods of manufacturing electronic devices

Publication Date: 2024.01.04 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and a substrate conductive structure. The substrate conductive structure includes a grounded path and a powered path. An electronic component is coupled to the substrate top side. An encapsulant covers the electronic component and the substrate top side. The encapsulant includes apertures and the powered path is exposed by the apertures. A first network structure includes a first network cover over the encapsulant. and first network interconnects coupled to the first network cover and the powered path through the apertures. A second network structure includes a second network cover having a second cover ceiling and second cover sidewalls extending from the second cover ceiling; and a second network contact coupled to the second network cover and the grounded path. The second network cover is over the first network cover and the first network cover is over the first electronic device. Other examples and related methods are also disclosed herein.