Stacked Photonics Die Layout With Bottom Optical Interconnect
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Solution Overview
Problem
Legacy photonics packaging systems face challenges with complex alignment, thermal solutions, and increased package size due to optical connections being positioned at the top, which complicates assembly and testing, and requires complex interconnect bridges and pigtails.
Innovation Solution
Incorporating an optical interconnect at the bottom of the photonics die, allowing for direct optical connections and reducing the need for vertical optical routing, which simplifies thermal management and package assembly by enabling a more compact and robust design with reduced interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical connections are positioned at the top of the package, then optical coupling is achieved, but device complexity and package size increase due to required interconnect bridges and pigtails
Solution Approach 1:
The patent inverts the conventional topology by positioning the optical interface at the bottom of the package instead of the top. This inversion eliminates the need for complex interconnect bridges and pigtails that dangle down from the top, thereby reducing packaging system complexity while maintaining optical coupling functionality.
Solution Approach 2:
The patent extracts and removes the unnecessary interconnect bridges and pigtails from the packaging system by repositioning the optical interface to the bottom, where direct optical connections can be made without requiring these additional components.
2Reliability
If optical connections are positioned at the top of the package, then optical coupling is achieved, but manufacturing complexity and testing difficulty increase
Solution Approach 1:
By inverting the optical interface position to the bottom, the patent enables more straightforward assembly processes and testing procedures, eliminating the complexity associated with top-mounted optical connections that require precise alignment of interconnect bridges and pigtails.
3Temperature
If thermal cooling features are pressed against the top of the package, then thermal management is achieved, but space for optical connectors is reduced
Solution Approach 1:
The patent resolves the space conflict by inverting the optical interface location to the bottom of the package, allowing thermal cooling features to occupy the top surface without encroaching on optical connector space. This separation of functions eliminates the need to choose between thermal management and optical connectivity space.
4Adaptability or versatility
If integrated plugs are used to route optical signals, then space routing issues are resolved, but package size and complexity increase
Solution Approach 1:
The patent extracts and eliminates the need for integrated plugs by positioning the optical interface at the bottom, where direct optical connections can be made without requiring additional routing components that would increase package size.
Data Source
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.