Stacked Conductive Pillar Connectors for Dense Semiconductor Pads
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Solution Overview
Problem
The increasing demand for higher integration density in semiconductor dies leads to a challenge of packing a greater number of pads into smaller areas, requiring innovative solutions for efficient packaging and testing.
Innovation Solution
The method involves forming a semiconductor die with a substrate, conductive pads, a passivation layer, interconnecting lines, and connectors that include a stacked structure of first and second conductive pillars, allowing for efficient electrical connections and testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more pads are packed into smaller areas to increase integration density, then the quantity of pads increases, but the manufacturing precision and alignment difficulty worsen
Solution Approach 1:
The connector is segmented into a first conductive pillar and a second conductive pillar, with the second pillar having a smaller span than the first pillar. This segmentation allows for easier alignment during testing while maintaining high pad density, as the smaller second pillar can be more precisely positioned on the pad.
Solution Approach 2:
The connector uses a stacked structure where the second conductive pillar is positioned above the first conductive pillar. This vertical dimensionality allows the connector to reach pads in a crowded layout without increasing the horizontal footprint, thereby maintaining high integration density while enabling precise alignment through vertical positioning.
2Quantity of substance
If pads are packed more densely, then the integration density improves, but the risk of bridging or incorrect contact increases
Solution Approach 1:
The connector is divided into two distinct pillars: a first conductive pillar with larger span for structural support and electrical connection, and a second conductive pillar with smaller span for precise pad contact. This segmentation reduces the risk of bridging between adjacent connectors while maintaining reliable contact with the pad.
Solution Approach 2:
The first conductive pillar acts as an intermediary between the substrate and the second conductive pillar. It provides a stable base and electrical connection path, while the second pillar makes the actual contact with the pad, thereby isolating the critical contact point from potential bridging issues.
3Adaptability or versatility
If more functions are integrated into semiconductor dies, then the functionality increases, but the device complexity increases
Solution Approach 1:
The connector structure serves multiple functions: it provides electrical connection from the substrate to the pad, acts as a testing interface, and enables alignment tolerance compensation. The stacked pillar design universally applies to various pad layouts and testing scenarios, reducing the need for different connector types for different functions.
Data Source
AI summary
A semiconductor die and methods of forming the same and a package structure are provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads over the semiconductor substrate, a passivation layer over the semiconductor substrate and partially covering the plurality of conductive pads, an interconnecting line disposed on the passivation layer, and a plurality of connectors disposed on and electrically connected to the plurality of conductive pads. Each of the plurality of connectors includes a stacked structure of a first conductive pillar and a second conductive pillar disposed directly on the first conductive pillar, wherein a span of the second conductive pillar is smaller than a span of the first conductive pillar, and an orthogonal projection of the second conductive pillar falls within an orthogonal projection of the first conductive pillar, and the interconnecting line is located beside and spaced apart from the plurality of connectors.