Stacked Pinhole Camera Structure for Ultra-Low Profile Imaging
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Solution Overview
Problem
Existing pinhole cameras face challenges in reducing their profile size due to the limitations of housing and lens structures, which restrict the miniaturization of image sensor chips and limit the resolution and angle of view.
Innovation Solution
A pinhole camera design featuring a semiconductor substrate with a pixel array, a protective substrate stacked through a seal resin, and a light shielding film with a pinhole formed in it, allowing for further reduction in profile size while maintaining image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a housing and pedestal structure is used in a pinhole camera, then the camera can be assembled with standard components, but the profile size cannot be reduced further
Solution Approach 1:
The patent merges the housing, pedestal, and image sensor chip into a single integrated semiconductor package structure. The pinhole camera unit is formed directly on the semiconductor substrate, eliminating the need for separate housing and pedestal components, thereby achieving both ease of manufacture through standard semiconductor processes and significant profile reduction.
Solution Approach 2:
The patent embeds the pinhole camera unit within the semiconductor package structure. The light shielding film with pinhole is formed on the protective substrate that covers the semiconductor substrate, creating a nested configuration where the imaging function is integrated within the package rather than requiring external housing structures.
2Device complexity
If the pinhole depth is equal to the housing depth, then the structural relationship is simplified, but the hole diameter cannot be reduced and resolution and angle of view are limited
Solution Approach 1:
The patent changes the aspect ratio parameter of the pinhole by forming it in a light shielding film that is positioned closer to the image sensor chip. This allows the pinhole depth-to-diameter ratio to be optimized independently, enabling smaller hole diameters for higher resolution and wider angle of view while maintaining structural simplicity through the integrated package design.
3Reliability
If a lens is placed on the housing or pedestal, then the camera module can focus light, but the overall size increases and profile reduction is difficult
Solution Approach 1:
The patent extracts the lens from the traditional housing-mounted position and integrates it directly onto the image sensor chip within the semiconductor package. This eliminates the need for a separate lens housing and pedestal structure, maintaining light focusing capability while enabling significant profile reduction to chip-scale dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a significant reduction in the camera's profile size without compromising image resolution or angle of view, enhancing the miniaturization of pinhole camera systems.
Implementation Method 1
a light shielding film formed on the protective substrate and configured to block light to be irradiated upon the semiconductor substrate
Data Source
AI summary
The present disclosure relates to a pinhole camera, an electronic apparatus and a manufacturing method, an electronic apparatus and a manufacturing method by which further reduction in profile can be achieved. The pinhole camera includes a semiconductor substrate on which a pixel array unit on which a plurality of pixels are arranged in an array is formed, a protective substrate stacked on an on-chip lens arranged corresponding to a pixel array unit of the semiconductor substrate through a seal resin, and a light shielding film formed on the protective substrate and configured to block light to be irradiated upon the semiconductor substrate. A pinhole is formed in the light shielding film. The present technology can be applied, for example, to a CMOS image sensor of the stacked type.