3D Stacked Pixel Circuit for In-Sensor Analog Image Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current imaging devices require external processing for image data conversion and processing, leading to increased power consumption, circuit area, and reduced convenience due to the need for analog data conversion before processing can occur.
Innovation Solution
An imaging device with a pixel block and circuit structure that includes photoelectric conversion devices, transistors, and capacitors, allowing for analog data processing and retention within the device, enabling image processing, reducing power consumption, and increasing integration and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If image data is converted to digital data and processed externally, then processing can be performed, but power consumption increases and convenience decreases
Solution Approach 1:
The patent implements a stacked three-dimensional structure where the first substrate contains photoelectric conversion units and the second substrate contains processing circuits. This vertical integration allows analog data processing to occur directly at the sensor array without external conversion, reducing power consumption and improving convenience by eliminating the need for analog-to-digital conversion outside the device.
Solution Approach 2:
The imaging device performs image processing functions internally using the processing circuits integrated on the second substrate. The device can execute processing operations such as correlation double sampling and other image processing tasks without requiring external processing equipment, making the system self-sufficient and reducing overall power consumption.
2Area of stationary object
If analog data is converted to digital data externally, then processing can be performed, but circuit area increases
Solution Approach 1:
By transitioning from a planar to a three-dimensional stacked architecture, the patent accommodates both photoelectric conversion units and processing circuits within a compact vertical footprint. The first substrate holds the sensor array while the second substrate holds the processing circuits, enabling complex processing capabilities without proportionally increasing the device's planar area.
3Speed
If image processing is performed externally, then processing can be performed, but communication speed decreases
Solution Approach 1:
The patent merges the photoelectric conversion function and the image processing function into a single integrated device. The processing circuits on the second substrate are electrically connected to the photoelectric conversion units on the first substrate, allowing data to be processed internally without requiring external communication interfaces. This integration eliminates communication bottlenecks and increases processing speed.
4Adaptability or versatility
If more processing functions are added to the imaging device, then processing capability improves, but device complexity increases
Solution Approach 1:
The three-dimensional stacked structure provides additional spatial dimensions for integrating multiple processing functions. The second substrate can accommodate various processing circuits including correlation double sampling circuits, memory units, and other processing functionality without significantly increasing the planar footprint or overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient image processing within the imaging device, reducing power consumption, circuit area, and enhancing integration while maintaining high reliability and convenience by allowing analog data processing without the need for external conversion.
Implementation Method 1
each of the plurality of pixels includes a photoelectric conversion device
Implementation Method 2
each of the plurality of pixels includes a photoelectric conversion device, a first transistor, a second transistor, and a capacitor
Data Source
AI summary
An imaging device capable of executing image processing is provided. An imaging device with low power consumption is provided. A highly reliable imaging device is provided. An imaging device with higher integration degree of pixels is provided. An imaging device manufactured at low cost is provided. The imaging device includes a photoelectric conversion device, a first transistor that is formed in a first layer and includes silicon in a channel formation layer, and a capacitor that is formed in a second layer bonded to the first layer. One of a source and a drain of the first transistor is electrically connected to one of electrodes of the photoelectric conversion device, and the other of the source and the drain of the first transistor is electrically connected to one of electrodes of the capacitor. A pixel having a function of generating first data and a function of multiplying the first data to have a given magnification to generate second data is included. The first data and the second data each have an analog value.