Stacked Light-Receiving Pixel Layout for Higher Charge-Voltage Conversion

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Solution Overview

Problem

Existing imaging devices face challenges in achieving improved conversion efficiency of electric charge into voltage.

Innovation Solution

A light-receiving device comprising a first substrate with photoelectric conversion sections, a second substrate with readout circuits, and a through-electrode coupling the readout circuits, allowing for efficient signal transmission and reduced wiring capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional imaging devices are used, then the structure is simple, but the conversion efficiency of electric charge into voltage is insufficient

Engineering Contradiction:
Improveconversion efficiencyVSAvoiddevice structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The imaging device is divided into separate substrates: a first substrate containing photoelectric conversion sections and a second substrate containing readout circuits. This segmentation allows optimization of each substrate's function independently, improving conversion efficiency while managing device complexity through modular architecture

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a planar layout to a three-dimensional stacked configuration where the first substrate and second substrate are bonded together vertically. This dimensional change reduces the distance between photoelectric conversion sections and readout circuits, enhancing conversion efficiency without significantly increasing overall device footprint

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the distance between photoelectric conversion sections and readout circuits is reduced, then conversion efficiency improves, but wiring complexity increases

Engineering Contradiction:
Improveconversion efficiencyVSAvoidwiring structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The readout circuits are integrated onto the same second substrate, and through-electrodes are used to connect them to the first substrate. This merging approach consolidates the wiring structure and reduces the number of external connections needed, improving conversion efficiency while controlling wiring complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Through-electrodes serve as intermediaries that penetrate the second substrate to establish electrical connections between the readout circuits on the second substrate and the photoelectric conversion sections on the first substrate. This intermediary structure simplifies the wiring architecture by providing direct vertical pathways for signal transmission

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances conversion efficiency by reducing wiring capacitance and shortening the distance between photoelectric conversion sections and readout circuits, leading to improved pixel signal quality.

Implementation Method 1

a first substrate including a plurality of photoelectric conversion sections that photoelectrically converts light

Methodology Applied
Scientific EffectPhotoelectric conversion: Photoelectric Effect

Data Source

PatentUS20250040284A1Light-receiving device
Publication Date: 2025.01.30 SONY SEMICON SOLUTIONS CORP
  • US20250040284A1 patent drawing
  • US20250040284A1 patent drawing
  • US20250040284A1 patent drawing

AI summary

A light-receiving device according to an embodiment of the present disclosure includes: a first substrate including a plurality of photoelectric conversion sections that photoelectrically converts light; a second substrate including a plurality of readout circuits that outputs a first signal based on electric charge photoelectrically converted by the photoelectric conversion sections; and a first through-electrode coupled to each of the readout circuits and penetrating the second substrate. The first substrate and the second substrate are stacked by bonding between electrodes to allow a first surface of the first substrate on which an element is formed and a second surface of the second substrate on which an element is formed to be opposed to each other. The first through-electrode is provided for each of the readout circuits or for every plurality of readout circuits.