Stacked Imaging Pixel Capacitor Layout for kTC Noise Reduction

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Solution Overview

Problem

Multilayer imaging devices face challenges in reducing kTC noise during reset operations due to the difficulty in completely transferring electric charges from a photoelectric conversion unit to a semiconductor substrate, limiting the effectiveness of noise reduction methods like correlated double sampling.

Innovation Solution

The imaging device incorporates a capacitor circuit with serially connected capacitors of different capacitance values between the photoelectric conversion unit and a reference voltage, along with a feedback circuit that negatively feeds back the electric signal, allowing for effective reduction of kTC noise and enabling the second transistor to function as both a reset and gain switching transistor, which helps in miniaturizing cells and reducing dark current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a photoelectric conversion unit is stacked on a semiconductor substrate to form a multilayer imaging device, then the imaging functionality is enhanced, but kTC noise generated during reset operations increases due to incomplete charge transfer

Engineering Contradiction:
Improveimaging functionalityVSAvoidkTC noise
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

A transfer transistor is introduced as an intermediary component between the photoelectric conversion unit and the semiconductor substrate. This transfer transistor facilitates complete charge transfer by actively controlling the charge flow, thereby eliminating the incomplete charge transfer problem that causes kTC noise while preserving the multilayer imaging structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

A feedback circuit is implemented that monitors the charge transfer process and adjusts the reset operation accordingly. The feedback mechanism ensures that charge is completely transferred before reset occurs, preventing kTC noise generation while maintaining the enhanced imaging functionality of the multilayer structure

Inventive Principle:
Principle #23Feedback

2Object-generated harmful factors

If correlated double sampling is used to reduce reset noise, then noise reduction is achieved, but the method becomes ineffective due to incomplete charge transfer from photoelectric conversion unit to substrate

Engineering Contradiction:
Improvereset noiseVSAvoidnoise reduction effectiveness
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The transfer transistor performs preliminary charge transfer action before the reset operation occurs. By ensuring complete charge transfer in advance, the conditions for effective correlated double sampling are created, making the noise reduction method reliable

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

A feedback mechanism monitors charge transfer completion and coordinates with the correlated double sampling timing. This feedback ensures that sampling occurs only after complete charge transfer, restoring the effectiveness of correlated double sampling for reset noise reduction

Inventive Principle:
Principle #23Feedback

3Device complexity

If the pixel configuration is simplified to reduce device complexity, then manufacturing becomes easier, but dark current increases due to transistor junction leakage

Engineering Contradiction:
Improvepixel configurationVSAvoiddark current
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

Multiple transistor functions are merged into a single integrated transistor structure. The transfer transistor simultaneously performs charge transfer, reset, and gain switching functions, simplifying the pixel configuration while minimizing junction leakage through optimized device design

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The transfer transistor is designed with multi-functionality to perform charge transfer, reset operation, and gain switching. This universal approach reduces the number of transistors needed while controlling dark current through careful design of the multi-functional device

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces kTC noise, allows for sensitivity switching, and minimizes transistor junction leakage, thereby enhancing the imaging device's performance by reducing dark current and noise while maintaining a dynamic range with a simple pixel configuration.

Implementation Method 1

a photoelectric converter that converts incident light into a signal charge

Methodology Applied
Scientific EffectPhotoelectric conversion: Photoelectric Effect

Data Source

PatentUS12080732B2Imaging device including a photoelectric converter and a capacitive element having a dielectric film sandwiched between electrodes and a mode switching transistor
Publication Date: 2024.09.03 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US12080732B2 patent drawing
  • US12080732B2 patent drawing
  • US12080732B2 patent drawing

AI summary

An imaging device including a semiconductor substrate; a photoelectric converter that converts incident light into a signal charge, the photoelectric converter being stacked on the semiconductor substrate; a node to which the signal charge is input; a transistor having a source and a drain, one of the source and the drain being connected to the node; and a capacitive element connected between the transistor and a voltage source or a ground. The transistor is configured to switch between a first mode and a second mode, a sensitivity in the first mode being different from a sensitivity in the second mode, and in a cross-sectional view, the capacitive element is located between the semiconductor substrate and the photoelectric converter.