Stacked Pixel Image Sensor Layout for LED Flicker Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional semiconductor image sensors face issues with flickering images when not synchronized with pulsing light sources, such as LED devices, and have difficulty controlling pixels due to a metal grid that blocks light, leading to suboptimal performance in applications like automotive surveillance.

Innovation Solution

A semiconductor structure with a trench isolation dividing the substrate into sensing units, each comprising a first and second pixel with overlapping configurations, along with gate electrodes and a trench isolation structure to improve image sensor performance, allowing for better light collection and reduced flickering effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor image sensors are used, then they can detect light, but they experience flickering issues with LED light sources and have light blocked by metal grids

Engineering Contradiction:
Improveimage sensor performanceVSAvoidflickering effects
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The image sensor is divided into multiple pixels with different gate electrode configurations. Specifically, first pixels have gate electrodes oriented in a first direction while second pixels have gate electrodes oriented in a second direction perpendicular to the first direction. This segmentation allows different pixel regions to capture light from different LED pulsing patterns, and through pixel binning, the flickering effects are averaged out to produce stable images.

Inventive Principle:
Principle #1Segmentation

2Productivity

If conventional image sensors are used, then they can capture images, but metal grids block light and complicate pixel control

Engineering Contradiction:
Improvelight collection efficiencyVSAvoidpixel control complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent removes the conventional metal grid structure that blocks light and complicates control. Instead, isolated pixel regions are formed without requiring metal grids for isolation or control, thereby eliminating light blocking while simplifying the pixel control architecture.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a new dimension of control by orienting gate electrodes in two perpendicular directions (first direction and second direction) across different pixel regions. This dimensional approach to gate electrode orientation provides enhanced control over light capture patterns without requiring traditional metal grid structures, thereby improving light collection efficiency while maintaining simplified pixel control.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed structure enhances image sensor performance by minimizing flickering and improving light control, ensuring more accurate and stable image capture, particularly in applications with pulsing light sources.

Implementation Method 1

These devices utilize an array of pixels (which may include photodiodes and transistors) to detect radiation using photogeneration of electron-hole pairs.

Methodology Applied
Scientific EffectPhotogeneration: Photoelectric Effect

Data Source

PatentUS20240047487A1Semiconductor structure and method of manufacturing the same
Publication Date: 2024.02.08 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240047487A1 patent drawing
  • US20240047487A1 patent drawing
  • US20240047487A1 patent drawing

AI summary

An image sensor device includes a semiconductor substrate having a first side, and a trench isolation structure dividing the substrate into sensing units. Each sensing unit includes a first gate electrode and a second gate electrode disposed on the first side, and a first pixel and a second pixel extending into the substrate and disposed between the first and second gate electrodes from a top view perspective. The first pixel is disposed under the second pixel and electrically connected to the first gate electrode, and the second pixel is electrically connected to the second gate electrode. A method of manufacturing a semiconductor structure includes forming a trench isolation in a semiconductor substrate; forming a first pixel in the substrate; forming a second pixel in the substrate over the first pixel; forming a first gate structure over the substrate; and forming a second gate structure over the second pixel.