Stacked Pixel-Layer Detector for Thick-Wafer Internal Imaging
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Solution Overview
Problem
Existing image capturing devices struggle to achieve high-resolution, non-destructive observation of thick subjects like silicon wafers with complex internal structures, such as memory chip areas, due to limitations in manufacturing complexity and accuracy.
Innovation Solution
An image capturing device with a stacked pixel layer configuration, utilizing superconducting nanostrip detectors and a control analysis unit to reconstruct images from multiple detection intensity profiles, enabling high-accuracy image reconstruction by combining deformed portions from each pixel layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a transmission X-ray microscope is used to observe thick subjects with complex internal structures, then high-resolution non-destructive observation is achieved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The detector is divided into multiple pixel layers (first pixel layer, second pixel layer, third pixel layer) stacked in the thickness direction. Each pixel layer detects X-rays at different depths, and the image processor combines these detections to reconstruct high-resolution images of internal structures. This segmentation allows the system to handle thick subjects with complex internal structures by capturing depth-resolved information without requiring a single overly complex detector.
2Manufacturing precision
If multiple pixel layers are stacked to detect deformed portions at different depths, then image reconstruction accuracy is improved, but device complexity increases
Solution Approach 1:
The detector utilizes the thickness direction (Z-axis) as an additional dimension by stacking multiple pixel layers. Each pixel layer detects deformed portions at different depth positions, transforming a two-dimensional detection problem into a three-dimensional one. The image processor then reconstructs images by integrating information across this third dimension, improving reconstruction accuracy without requiring excessive complexity in each individual layer.
3Measurement precision
If a stacked pixel layer configuration is implemented, then high-resolution imaging of internal structures is achieved, but manufacturing difficulty increases
Solution Approach 1:
The detection task is segmented across multiple pixel layers, with each layer responsible for detecting X-rays at its specific depth position. This segmentation allows each layer to be manufactured using standard pixel layer technologies, avoiding the need to manufacture a single overly complex detector. The stacked configuration simplifies the manufacturing of individual layers while achieving high-resolution internal structure imaging through their combination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device simplifies manufacturing and achieves high-resolution imaging of internal structures in thick subjects by accurately reconstructing images from multiple detection layers, enhancing observation capabilities.
Implementation Method 1
Each of the first to fourth pixel layers includes a plurality of line-shaped pixels... the detector is configured to output a first detection intensity profile detected by the first pixel layer, a second detection intensity profile detected by the second pixel layer, a third detection intensity profile detected by the third pixel layer, and a fourth detection intensity profile detected by the fourth pixel layer
Data Source
AI summary
An image capturing device includes a stage holding a subject; a detector including a first pixel layer, a second pixel layer, and a third pixel layer stacked on top of one another, with an insulating film interposed adjacent ones of the first to third pixel layers; an image formation optical member configured to form, on the detector, an image based on imaging light transmitted through the subject; and an image processor configured to reconstruct an image of the subject based on a detection intensity of the imaging light detected by the detector.