Stacked Display Pixel Wafer Pairing for Higher Fabrication Yield

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Solution Overview

Problem

The yield of light emitting devices with a stacked structure is low due to defective locations on individual wafers, leading to significant losses as favorable locations on other wafers are discarded during the fabrication process.

Innovation Solution

A method involving measuring emission wavelengths on wafers, forming test stacked structures, calculating combination yields based on overlapping defective locations, and selecting optimal wafer combinations for subsequent processing to maximize yield, including using a computational program to determine and compare yields across different combinations of wafers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wafers are stacked to form a light emitting device with a stacked structure, then the number of LED chips is reduced and fabrication time is shortened, but the overall yield decreases due to defective locations on individual wafers

Engineering Contradiction:
Improvefabrication timeVSAvoidyield
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies preliminary action by measuring emission wavelengths and identifying defective locations on each wafer before stacking. This allows the system to pre-determine which wafers can be successfully combined, preventing waste of favorable locations during the stacking process. The computational program calculates combination yields in advance to guide wafer selection and arrangement.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the parameter of wafer selection from random or sequential to optimized based on emission wavelength measurements. By varying which wafers are stacked together based on their measured characteristics and calculated combination yields, the system maximizes the number of functional subpixels in the final device.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If all wafers are stacked together regardless of defective locations, then the fabrication process is simplified, but favorable locations on good wafers are discarded due to defects on other wafers

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidwaste of favorable locations
Core Design Contradiction:
Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent performs preliminary measurement of emission wavelengths and identification of defective locations before stacking. This preliminary action enables the computational program to calculate which wafer combinations will maximize yield, preventing the waste of favorable locations that would occur with random stacking.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback by using measurement results of emission wavelengths to guide the stacking process. The computational program receives data about defective locations on each wafer and uses this feedback to determine optimal wafer combinations, ensuring that favorable locations are not wasted.

Inventive Principle:
Principle #23Feedback

3Reliability

If emission wavelength measurement and combination yield calculation are performed for all wafer combinations, then optimal wafer selection is achieved, but measurement and processing time increase

Engineering Contradiction:
Improveyield optimizationVSAvoidmeasurement and processing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies segmentation by dividing the wafer group into manageable units and measuring emission wavelengths at predetermined locations on each wafer separately. The computational program then processes these segmented measurements to calculate combination yields, making the overall optimization process more efficient than treating all wafers as a single group.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the fabrication yield of light emitting devices by identifying and utilizing optimal wafer combinations, reducing waste and increasing the efficiency of the manufacturing process.

Implementation Method 1

Light emitting diodes have been used in various fields including displays, vehicular lamps, general lighting, and the like. With various advantages such as long lifespan, low power consumption, and rapid response, light emitting diodes have been replacing existing light sources in the art.

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS20230299229A1Display apparatus
Publication Date: 2023.09.21 SEOUL VIOSYS CO LTD
  • US20230299229A1 patent drawing
  • US20230299229A1 patent drawing
  • US20230299229A1 patent drawing

AI summary

A display apparatus includes multiple pixels. The pixels can emit one or more colors of light. Light of the same color emitted by two or more of the pixels can have wavelengths that differ by no more than one percent. The pixels can include a stacked structure including two or more subpixels, with each subpixel emitting light of a different color than the other subpixels in the stacked structure.