Stacked Planar Windings for Compact Phase Quadrature Combiner
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Solution Overview
Problem
Conventional phase quadrature combiners/splitters are bulky and suffer from high network losses, making them unsuitable for integrated circuits, especially at low frequencies, and they are not compatible with high currents, which affects miniaturization.
Innovation Solution
A distributed combiner/splitter design using planar conductive windings of increasing width from the outside to the inside in two stacked levels, with interdigited windings and lumped capacitive elements to enhance coupling and reduce bulk, allowing for reduced line lengths and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional distributed line combiners/splitters are used, then phase quadrature distribution is achieved, but the device becomes bulky and suffers from high network losses
Solution Approach 1:
The patent transitions from planar distributed lines to three-dimensional stacked planar windings. Multiple conductive windings are arranged in stacked levels (first and second conductive levels) with interdigitated patterns, utilizing the vertical dimension to achieve compact phase quadrature combining/splitting without requiring long horizontal line lengths.
Solution Approach 2:
The patent employs interdigitated windings where conductive elements of different phases are nested within each other in a compact pattern. The windings in different levels are interlaced, creating a nested structure that maximizes coupling while minimizing the overall device footprint.
2Reliability
If conventional distributed line combiners/splitters are used, then phase quadrature distribution is achieved, but network losses increase
Solution Approach 1:
By moving to stacked three-dimensional windings, the patent reduces the total length of conductive paths required for phase quadrature combining. The vertical stacking and interdigitated arrangement create stronger electromagnetic coupling, reducing the need for long transmission lines and thereby minimizing resistive losses.
Solution Approach 2:
The patent uses varying winding densities and interdigitated patterns that concentrate electromagnetic coupling in specific regions. The local arrangement of interlaced windings optimizes the coupling coefficient in critical areas while reducing overall path length, thereby minimizing energy losses.
3Power
If conventional combiners are used, then power distribution is achieved, but heat dissipation becomes problematic for high currents
Solution Approach 1:
The stacked multi-level winding structure distributes current paths in three dimensions rather than confining them to a single plane. This spatial distribution reduces current density in any single conductor, improving heat dissipation efficiency and enabling the device to handle higher currents.
Solution Approach 2:
The patent divides the current path into multiple segmented windings arranged in stacked levels. Each winding carries a portion of the total current, and the distributed arrangement across multiple levels improves thermal management by spreading heat generation throughout the three-dimensional structure.
4Volume of stationary object
If line length is reduced for miniaturization, then device bulk is reduced, but current handling capability decreases
Solution Approach 1:
The patent uses vertical stacking of conductive windings to maintain effective current handling capability while reducing horizontal footprint. The multi-level interdigitated structure provides multiple parallel current paths in the vertical dimension, compensating for reduced individual conductor lengths and enabling compact high-current operation.
Solution Approach 2:
The patent combines multiple windings in parallel across stacked levels, where each winding contributes to the total current handling capability. The interdigitated arrangement merges the electromagnetic fields of adjacent windings, creating efficient coupling while distributing current load across multiple conductive paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a compact, low-loss combiner/splitter with reduced bulk and improved heat dissipation, enabling compatibility with high currents and efficient phase quadrature performance, suitable for integrated circuits.
Implementation Method 1
distributed or coupled lines (conductive lines arranged sufficiently close to each other to generate an electromagnetic coupling)
Implementation Method 2
a first capacitive element connects the external ends of the first and third windings; and a second capacitive element connects the external ends of the second and fourth windings
Data Source
AI summary
A distributed combiner/splitter having a first line formed of a first planar winding in a first conductive level and of a second planar winding in a second conductive level, and a second line formed of a third planar winding interdigited with the first winding in the first level, and of a fourth planar winding interdigited with the second winding in the second level, the windings having an increasing width from the outside to the inside.