Stacked Plate Inductor Structure for Low-Loss PCB Integration
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Solution Overview
Problem
Conventional inductor components integrated into component carriers, such as printed circuit boards, suffer from high electrical losses due to inefficiencies in design and material usage.
Innovation Solution
The development of an inductor component comprising stacked layer structures made of component carrier material, featuring thick electrically conductive plate structures and interconnect structures, which form multiple windings with high copper filling factors, thereby reducing ohmic losses and enhancing the Q-factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional inductor designs are used in printed circuit boards, then integration is achieved, but electrical losses are high
Solution Approach 1:
The patent changes the geometric parameters of the conductor from thin traces to thick plate structures with large cross-sectional areas. This parameter change reduces ohmic resistance according to R=ρL/A, where A is the cross-sectional area. The thick copper plates provide low-impedance current paths that significantly reduce electrical losses compared to conventional PCB traces.
Solution Approach 2:
The inductor combines multiple materials including thick copper plates for conduction, magnetic core materials (ferrite or powder core) for flux concentration, and insulating materials for structural support. This composite structure optimizes both electrical performance and magnetic properties, achieving low losses while maintaining reliability.
2Loss of energy
If thick electrically conductive plate structures are used, then ohmic losses are reduced, but manufacturing complexity increases
Solution Approach 1:
The inductor is divided into discrete stackable layers, each containing conductive plates, magnetic materials, and insulators. These segmented modules can be manufactured separately using standard PCB and wire-wrapping techniques, then assembled into the final inductor structure. This segmentation reduces manufacturing complexity while maintaining the low-loss benefits of thick conductors.
Solution Approach 2:
The design employs nested structures where conductive plates are positioned within or around magnetic core structures, which themselves are contained within insulating housings. This nested arrangement maximizes space utilization and simplifies assembly by allowing components to be stacked and interlocked in a systematic manner.
3Loss of energy
If multiple stacked layer structures are used to form windings, then inductance values increase, but device size increases
Solution Approach 1:
The patent transitions from planar winding patterns to three-dimensional stacked layer structures. By utilizing the vertical dimension with multiple stacked layers of conductive plates, the design achieves high inductance values in a compact footprint. The inductance is increased through the three-dimensional magnetic flux paths created by the stacked configuration rather than requiring large planar loop areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in an inductor component with low electrical losses, high inductance values, and a robust yet compact design, capable of efficiently propagating signals with minimal heat generation.
Implementation Method 1
connecting the electrically conductive plate structures by a plurality of electrically conductive interconnect structures to thereby form an inductance with multiple windings
Data Source
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AI summary
An inductor component (100) comprising a plurality of stacked layer structures (102) made of component carrier material and comprising electrically conductive plate structures (104), and a plurality of electrically conductive interconnect structures (106) connecting the electrically conductive plate structures (104) to thereby form an inductance with multiple windings.