Stacked Plated Coil Wiring Substrate for Compact Power Supply
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Solution Overview
Problem
Conventional pattern coils on printed boards are large in size, making it difficult to integrate them into processor packages, leading to increased impedance in power supply paths and reduced power efficiency due to constraints in arranging electronic components and magnetic materials.
Innovation Solution
A wiring substrate with a flat coil structure, comprising a first and second magnetic layer formed by plating, integrated with insulating layers and wiring layers, which allows for compact design and high inductance, reducing the size of the coil and improving power supply efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional spiral pattern coil is used on a printed board, then the coil can be manufactured with standard PCB processes, but the coil size becomes large making it difficult to install to processor packages
Solution Approach 1:
The patent transitions from a planar spiral coil pattern to a three-dimensional stacked coil structure with multiple layers connected by vias. This dimensional change allows the coil to achieve higher inductance in a smaller footprint area, resolving the contradiction between manufacturability and compact size by utilizing vertical space within the PCB layers
Solution Approach 2:
The patent embeds multiple coil patterns within stacked PCB layers, with coils nested vertically through the use of vias connecting different layers. This nesting approach allows multiple functional elements to occupy overlapping spatial footprints, reducing the overall coil size while maintaining manufacturability through standard multilayer PCB processes
2Volume of moving object
If the coil size is reduced for package installation, then the coil can be installed to processor packages, but the impedance increases and power efficiency decreases
Solution Approach 1:
By stacking coil patterns across multiple PCB layers and connecting them with vias, the patent creates a three-dimensional coil structure that maintains low impedance and high power efficiency while achieving compact size. The vertical stacking allows magnetic flux to be contained within a smaller horizontal footprint without increasing resistance
Solution Approach 2:
The patent uses composite construction combining multiple copper trace patterns across different PCB layers, connected by conductive vias filled with conductive material. This composite structure maintains electrical continuity and low impedance while achieving compact dimensions suitable for processor package installation
3Reliability
If magnetic materials are arranged near the coil to improve inductance, then the inductance increases, but the component arrangement becomes constrained and size increases
Solution Approach 1:
The patent integrates magnetic material layers within the stacked coil structure, nesting them between or around the coil patterns on different PCB layers. This nested arrangement provides the necessary magnetic flux path for high inductance while maintaining a compact overall footprint and avoiding additional external components
Solution Approach 2:
The patent combines the coil patterns and magnetic material layers into a single integrated multilayer structure, where magnetic layers are incorporated within the same PCB stack-up as the coil traces. This merging eliminates the need for separate magnetic component arrangements, reducing the overall area while maintaining high inductance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact coil design enhances power supply efficiency by reducing impedance and noise interference, while allowing for more efficient voltage transformation and power supply in electronic devices.
Implementation Method 1
a first magnetic layer that is a first plating film formed on the first insulating layer... and a second magnetic layer that is a second plating film formed on the flat coil
Data Source
AI summary
A wiring substrate includes a first insulating layer, a first magnetic layer that is a first plating film formed on the first insulating layer, a flat coil formed on the first magnetic layer, and a second magnetic layer that is a second plating film formed on the flat coil.