Stacked Power Module Architecture for Coupling and Parasitic Losses
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Solution Overview
Problem
Existing power regulation devices face issues such as coupling and heating effects, parasitic capacitance, and integration limitations due to the arrangement of power regulator components relative to the powered system, which affect efficiency and interconnection in modular power systems.
Innovation Solution
A modular power system is designed with pre-characterized power modules that include a voltage regulator and inductor on a common substrate, positioned to minimize interference and optimize power density, with the inductor and voltage regulator stacked to reduce magnetic coupling and parasitic losses, and multiple modules interconnected to achieve desired power characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power regulator components are arranged in conventional configurations, then integration is achieved, but coupling and heating effects increase
Solution Approach 1:
The patent transitions from planar arrangement of power regulator components to a three-dimensional stacked configuration. The voltage regulator and inductor are vertically stacked on a common substrate, utilizing the vertical dimension to separate components that were previously arranged horizontally. This dimensional change reduces parasitic capacitance and magnetic coupling between components while maintaining compact integration.
2Power
If inductor and voltage regulator are placed close together for integration, then power density increases, but magnetic coupling and parasitic losses increase
Solution Approach 1:
The patent employs vertical stacking to place the inductor and voltage regulator in close proximity for high power density while using the vertical separation to reduce parasitic losses. The stacked configuration on a common substrate allows components to be physically close (high power density) while the vertical arrangement minimizes parasitic capacitance and magnetic coupling (reduced losses).
Solution Approach 2:
The common substrate serves as an intermediary between the inductor and voltage regulator. It provides a controlled impedance environment and allows for optimized trace routing that minimizes parasitic effects. The substrate acts as a mediator that enables close component placement while managing the electromagnetic interactions between components.
3Loss of energy
If components are arranged to minimize interference, then efficiency improves, but device complexity increases
Solution Approach 1:
The patent uses vertical stacking to achieve component separation for reduced interference while maintaining a compact footprint. The three-dimensional arrangement on a common substrate provides natural isolation between components, reducing the need for additional shielding or complex routing that would increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances power density, reduces interference, and improves efficiency by minimizing unwanted effects like heating and coupling, allowing for flexible and compact power systems that meet the power requirements of integrated circuits.
Implementation Method 1
the inductor and voltage regulator stacked to reduce magnetic coupling
Implementation Method 2
A voltage regulator converts an input voltage to a different output voltage
Implementation Method 3
parasitic capacitance at the output stage
Implementation Method 4
coupling and heating effects
Data Source
AI summary
A power converter module includes a ground terminal, an input voltage terminal configured to receive a raw input voltage, and an interconnection terminal configured to provide a regulated output voltage to a load such as a SOC or SIP system to be powered. A voltage regulator is connected to the ground terminal and the input voltage terminal. An inductor has an inductor output connected to the interconnection terminal.