Flexible Printed Circuit Board With Stacked Power Lines
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Solution Overview
Problem
The miniaturization of signal transmission devices is hindered by the need for numerous coaxial cables in 5G environments, leading to challenges in reducing the area occupied by power transmission lines.
Innovation Solution
A flexible printed circuit board design with multiple power lines on different dielectric layers, connected via via holes, allowing for parallel connections and minimizing overlapping regions to increase current capacity within a limited area, while preventing short circuits and leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple coaxial cables are used for signal transmission in 5G environments, then signal transmission capability is improved, but device miniaturization is hindered due to increased area occupation
Solution Approach 1:
Multiple power lines (first power line on first dielectric layer, second power line on second dielectric layer, third power line on third dielectric layer) are merged into a single FPCB structure, connecting digital signal processing unit and RF signal processing unit through parallel power transmission paths. This consolidation replaces multiple separate coaxial cables with one integrated board, achieving miniaturization while maintaining signal transmission capability.
Solution Approach 2:
The patent utilizes the third dimension (vertical stacking of dielectric layers) to accommodate multiple power lines. By forming power lines on different dielectric layers (first, second, and third layers stacked vertically) and connecting them through via holes, the design achieves high current capacity in a compact planar area, resolving the contradiction between transmission capability and area occupation.
2Area of stationary object
If power transmission line area is minimized for device miniaturization, then device compactness is improved, but current capacity may be reduced
Solution Approach 1:
Multiple power lines are distributed across first, second, and third dielectric layers stacked vertically. This vertical arrangement allows parallel current paths without increasing planar area, maintaining high current capacity while minimizing the footprint of the power transmission system.
Solution Approach 2:
The patent employs a composite multi-layer structure consisting of multiple dielectric layers (first, second, third dielectric layers) with conductive power lines and via holes. This composite architecture enables efficient current distribution across layers, achieving high power transmission capability within a compact area through the synergistic combination of multiple materials and structures.
Data Source
AI summary
The present invention provides a flexible printed circuit board comprising: a first power line formed on one surface of a first dielectric layer; and a second power line formed on one surface of a second dielectric layer spaced apart from the first dielectric layer on a bottom surface of the first dielectric layer. There is an overlapping area in which the first power line and the second power line overlap, the first power line and the second power line are connected at a first end of the overlapping area through a via hole, and the first power line and the second power line are connected at a second end of the overlapping area through another via hole.