Stacked Power Module Layout for Heat Dissipation and Noise Reduction
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Solution Overview
Problem
Existing power conversion devices face challenges in efficiently dissipating heat while maintaining a compact size and minimizing noise interference, particularly in configurations with power element-embedded substrates.
Innovation Solution
The electronic device incorporates a wiring substrate with power element-embedded substrates mounted parallel to a mounting substrate, utilizing a heat dissipation member on the power element-embedded substrate side, and optionally stacking multiple module units to enhance heat dissipation and reduce noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power element-embedded substrates are mounted on wiring substrates parallel to the mounting substrate, then heat dissipation efficiency is improved, but device complexity increases due to the need for heat dissipation members and stacking arrangements
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional stacking, where multiple module units are arranged in the vertical dimension. This allows heat dissipation members to be positioned on the power element-embedded substrate side while maintaining compact footprint, resolving the contradiction between heat dissipation efficiency and device complexity
Solution Approach 2:
The device is divided into multiple independent module units, each containing a wiring substrate, power element-embedded substrate, and heat dissipation member. This segmentation allows for modular heat dissipation management and simplifies the overall structural complexity by standardizing repeatable units
2Temperature
If multiple module units are stacked to enhance heat dissipation, then heat dissipation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The wiring substrate serves multiple functions: electrical connection, mechanical support for power elements, and alignment reference for stacking. This multi-functionality reduces the need for separate alignment features, thereby lowering manufacturing precision requirements while maintaining effective heat dissipation through stacked configuration
3Temperature
If heat dissipation members are disposed on the power element-embedded substrate side, then heat dissipation efficiency is improved, but device volume increases
Solution Approach 1:
The heat dissipation member is integrated into the module unit structure, with the power element-embedded substrate mounted on the wiring substrate and the heat dissipation member positioned on the opposite side. This nested arrangement allows heat dissipation components to be incorporated without significantly increasing overall device volume, as elements are stacked rather than laterally arranged
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from power elements, reduces device size, and minimizes noise interference, while allowing for flexible design and redundancy in case of substrate damage.
Implementation Method 1
a heat dissipation member for thermally dissipating heat from the power element-embedded substrate being disposed on the power element-embedded substrate side of the wiring substrate
Data Source
AI summary
Provided is an electronic device including, a module unit including a wiring substrate and a power element-embedded substrate mounted on the wiring substrate; and a mounting substrate, the module unit being mounted on the mounting substrate so that the wiring substrate is parallel to or substantially parallel to the mounting substrate, a heat dissipation member for thermally dissipating heat from the power element-embedded substrate being disposed on the power element-embedded substrate side of the wiring substrate.