Stacked Power Module Layout for Low-Parasitic Decoupling
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Solution Overview
Problem
Existing power modules suffer from reduced integration, high manufacturing costs, and performance issues due to large planar areas, parasitic inductance and resistance, voltage oscillations, and thermal stress, which affect the reliability and efficiency of power semiconductors.
Innovation Solution
A power module design incorporating stacked sub-insulation layers between conductive layers, with decoupling capacitors and components connected through conductive layers, reducing parasitic inductance and resistance, and using accommodation cavities to house components, thereby improving integration and reducing voltage stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect chips to circuit board, then electrical connection is achieved, but parasitic inductance and resistance increase
Solution Approach 1:
The patent extracts and eliminates the wire bonding connection method, replacing it with direct conductive layer connections. The wires that cause parasitic inductance and resistance are removed from the system, and components are directly mounted on conductive layers to achieve electrical connection without intermediate wiring.
Solution Approach 2:
The patent introduces conductive layers as intermediary structures between components and circuit board. These conductive layers serve as both mechanical support and electrical connection paths, replacing the wire bonding intermediary with a more efficient direct conductive path that reduces parasitic effects.
2Ease of manufacture
If multiple components are arranged in planar configuration, then assembly is simplified, but planar area increases reducing integration
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional stacked configuration. Components are arranged vertically across multiple conductive layers and insulation layers, utilizing the thickness dimension to reduce the planar footprint while maintaining assembly simplicity through standardized layer stacking.
Solution Approach 2:
The patent implements a nested layered structure where conductive layers, insulation layers, and components are stacked sequentially. Each layer is embedded within the overall structure, with components mounted on conductive layers that are themselves embedded in insulation layers, creating a compact nested configuration.
3Adaptability or versatility
If components are connected through long leads, then connection flexibility is improved, but voltage oscillation increases
Solution Approach 1:
The patent removes the lead connections from the system entirely. Instead of using leads with length that cause voltage oscillation, components are directly mounted on conductive layers, eliminating the oscillation-generating element while maintaining electrical connection functionality.
Solution Approach 2:
The patent replaces the mechanical lead connection system with a direct conductive layer mounting system. The flexible lead mechanism is substituted with rigid conductive layer traces that provide both mechanical support and electrical connection without the oscillation problems of long leads.
Data Source
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AI summary
This application provides a power module, a power conversion device, and a vehicle. The power module includes: an insulation layer, a plurality of conductive layers, a decoupling capacitor, and a plurality of first components, where the insulation layer includes a plurality of sub-insulation layers stacked in a thickness direction of the power module, and the sub-insulation layer is disposed between every two adjacent conductive layers. The first component is located at a sub-insulation layer in a first region and is electrically connected to a conductive layer adjacent to the sub-insulation layer at which the first component is disposed, and at least some of the first components are stacked in the thickness direction of the power module. The insulation layer located in the first region has an auxiliary accommodation cavity, the decoupling capacitor is located in the auxiliary accommodation cavity, a first pin of the decoupling capacitor is electrically connected to one layer of the plurality of conductive layers, and a second pin of the decoupling capacitor is electrically connected to another layer of the plurality of conductive layers. Therefore, the power module, the power conversion device, and the vehicle provided in this application can improve integration of the power module, to further improve performance of the power conversion device and the vehicle.