3D Stacked Power Module for High Density Thermal Management
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Solution Overview
Problem
Existing power modules struggle to achieve high power density and efficiency while minimizing space and material usage, leading to increased energy consumption and heat generation, especially in high-frequency applications.
Innovation Solution
A power module design featuring multiple power chips molded in the same material, with at least one operating at frequencies above 25 kHz and an operation voltage greater than 48 volts, integrated with a heat sink and thermo-conductive insulating layer, which reduces switch and on-state losses, and enhances thermal and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the working frequency is increased to decrease audio noise, then the audio noise is reduced, but the switch loss is significantly increased
Solution Approach 1:
The patent transitions from a single-planar chip layout to a three-dimensional stacked architecture, allowing power chips to be vertically arranged on multiple levels. This dimensional change enables shorter current paths and reduced parasitic inductance, which lowers switch loss even at high frequencies above 25 kHz, while simultaneously maintaining effective audio noise suppression.
Solution Approach 2:
The patent implements a nested structure where power chips are stacked vertically with multiple chips nested within a compact volume. The lower chips are positioned beneath upper chips, creating a nested arrangement that reduces the overall footprint while maintaining high power density and reducing the loop area for noise generation, thereby addressing both audio noise and switch loss concerns.
2Volume of moving object
If the power density is increased to reduce size and weight, then the size and weight are reduced, but the thermal management becomes more challenging
Solution Approach 1:
The patent utilizes vertical stacking to achieve high power density in a compact volume, concentrating power chips in the vertical dimension. This three-dimensional arrangement improves thermal management by providing multiple exposed surfaces for heat dissipation and enabling direct thermal coupling between stacked chips and heat sinks, effectively managing heat in high-density configurations.
Solution Approach 2:
The patent introduces thermal interface materials and heat dissipation structures as intermediaries between the stacked power chips and the external environment. These intermediary elements facilitate efficient heat transfer from the densely packed chips, managing thermal loads in the compact high-power-density design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves power densities and efficiencies higher than 20 W/inch3 and 93%, respectively, with a reduced volume ratio and increased thermal uniformity, lowering energy consumption and heat generation, and is suitable for high-performance power converters.
Implementation Method 1
integrated with a heat sink and thermo-conductive insulating layer, which reduces switch and on-state losses, and enhances thermal and electrical performance
Data Source
AI summary
A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.