Stacked Power Module with Equalized Gate Drive Paths

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Solution Overview

Problem

The existing electronic devices with stacked substrates face issues in maintaining consistent operation timing due to variations in signal path lengths and require efficient layout of electronic components and wirings to manage increased functionality without increasing packaging area.

Innovation Solution

The electronic device incorporates a configuration with a first and second substrate stacked within a case, where semiconductor components are mounted on opposite sides with lead members and wirings connecting them to a gate drive circuit, ensuring equal path lengths for improved performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If substrates are stacked to increase functionality, then the number of electronic components is increased, but the packaging area increases

Engineering Contradiction:

ImprovefunctionalityVSAvoidpackaging area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar layout to a three-dimensional stacked configuration, placing the control substrate above the power substrate vertically. This dimensional change allows multiple electronic components to be accommodated within the same footprint area, increasing functionality without expanding the packaging area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of operation

If drive signals are supplied to switching elements through long paths, then connectivity is achieved, but operation timing becomes inconsistent

Engineering Contradiction:

ImproveconnectivityVSAvoidoperation timing consistency

Core Design Contradiction:

Ease of operationVSLoss of time

Solution Approach 1:

The patent designs the wiring paths on both substrates to have equal lengths, creating equipotential signal transmission conditions. By ensuring that the total path length from the control substrate to each switching element is equalized, signal propagation delays are balanced, maintaining consistent operation timing across all switching elements.

Inventive Principle:

Principle #12Equipotentiality

3Adaptability or versatility

If more electronic components are incorporated, then functionalization is improved, but layout efficiency is reduced

Engineering Contradiction:

ImprovefunctionalizationVSAvoidlayout efficiency

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent divides the electronic components into two distinct functional groups: power components (power transistors, diodes) on the power substrate and control components (drive circuits) on the control substrate. This segmentation allows each substrate to be optimized independently for its specific function, improving layout efficiency while accommodating increased functionality through vertical stacking.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS10284109B2Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistors

Publication Date: 2019.05.07 RENESAS ELECTRONICS CORP

AI summary

An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.