Stacked Power Module with Integrated Fluid Cooling
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Solution Overview
Problem
Current power electronics modules face challenges with heat removal, reliability, and parasitic inductance, leading to derating and performance issues due to large and heavy packaging, which limits their power density and efficiency.
Innovation Solution
A power module design that stacks power electronic components with integrated cooling, using conductive layers and a heat sink on multiple sides for effective thermal management, eliminating the need for solid dielectric substrates and reducing parasitic inductance through a structured layer configuration with pillars and a housing unit for fluid cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional power packages with DBC substrate, heat spreader, and wirebonds are used, then electrical connections and heat removal are achieved, but the packaging becomes large and heavy, reducing power density
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated structure. The electrically conductive layers serve dual purposes: providing electrical connectivity between power electronic components and acting as heat spreaders for thermal management, eliminating the need for separate wirebonds and heat spreader components, thus reducing packaging weight and volume while maintaining power density
Solution Approach 2:
The electrically conductive layers perform multiple functions simultaneously: electrical conduction, thermal conduction, and structural support. This multi-functionality reduces the number of separate components needed, directly addressing the weight and size issues associated with conventional packaging while maintaining high power density
2Reliability
If wirebonds and planar packaging topologies are used, then electrical connections are established, but parasitic inductance increases, causing voltage overshoot and ringing
Solution Approach 1:
The patent extracts and eliminates the wirebonds from the packaging structure, replacing them with direct electrically conductive layer connections. This removal of wirebonds directly reduces parasitic inductance and eliminates the associated voltage overshoot and ringing issues, while the conductive layers provide a more integrated and less complex structural solution
Solution Approach 2:
The patent replaces the mechanical wirebond connection system with an integrated electrically conductive layer system. This substitution eliminates the mechanical complexity of wire bonding while providing superior electrical and thermal performance with reduced parasitic inductance, directly addressing both reliability and complexity concerns
3Temperature
If heat sink is added to remove heat, then thermal management is improved, but the packaging size increases
Solution Approach 1:
The patent combines the heat spreader function with the electrical connection layers. The electrically conductive layers serve as integrated heat spreaders, eliminating the need for separate heat sink components. This merging of functions allows effective heat removal while maintaining compact packaging dimensions, directly addressing the contradiction between thermal management and packaging size
4Reliability
If devices are derated to account for thermal and inductance limitations, then reliability is maintained, but power output is reduced by up to 50%
Solution Approach 1:
The patent replaces the conventional packaging approach with an integrated structure that simultaneously addresses thermal management and parasitic inductance reduction. The electrically conductive layers provide both electrical connectivity and thermal management, while the eliminated wirebonds reduce inductance. This allows devices to operate at higher power levels without derating, maintaining reliability while achieving full power output potential
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces packaging size, weight, and cost while enhancing reliability and performance by addressing thermal challenges and minimizing inductance, allowing for higher power density and reduced snubber requirements.
Implementation Method 1
a cooling path integrated with each layer in the stack. The cooling path may accommodate any of a fluid and solid to liquid phase change materials
Implementation Method 2
The cooling path may accommodate any of a fluid and solid to liquid phase change materials
Implementation Method 3
a heat sink operatively connected to multiple sides of each power electronic component in the stack
Data Source
AI summary
A power module including a plurality of power die layers including power electronic components; a plurality of heat sink components operatively connected to multiple sides of each power electronic component; a plurality of electrically conductive layers contacting the plurality of heat sink components, wherein a power die layer and an electrically conductive layer sequentially alternate to form a stacked structure such that both ends of the stacked structure includes an end electrically conductive layer. A cooling path is integrated with each layer in the stacked structure. A housing unit houses the stacked structure. The power electronic components may include heat-producing electronic devices. The cooling path may accommodate any of a fluid and solid to liquid phase change materials. The fluid comes into direct contact with the power die layers, heat sink components, and electrically conductive layers.