Stacked Power Module Reducing Inductance and Noise
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Solution Overview
Problem
Power semiconductor switches in electric vehicle power modules are sensitive to electronic noise and generate significant heat due to high switching speeds, requiring effective noise reduction and thermal management.
Innovation Solution
A compact power module design with a stacked pseudo-double sided structure, featuring overlapping circuit elements and thermal conductors between DC bus members and an AC output bus, which reduces inductive coupling and enhances thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high switching speeds are used in power semiconductor switches, then power conversion efficiency is improved, but electronic noise sensitivity increases due to induced or parasitic inductance
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked configuration where circuit elements are arranged in multiple layers vertically. This dimensional change allows power and control loops to be formed in different spatial planes, reducing parasitic inductance by minimizing current loop areas while maintaining high switching speeds for efficient power conversion.
Solution Approach 2:
The patent implements nested circuit structures where control circuits are positioned within or adjacent to power circuit elements. This nesting minimizes the distance between control signals and power switches, reducing parasitic inductance and electronic noise sensitivity while enabling high-speed switching operation.
2Productivity
If high switching speeds are used in power semiconductor switches, then power conversion efficiency is improved, but heat generation increases requiring cooling
Solution Approach 1:
The patent combines power circuits and control circuits into a single integrated stacked module structure. This merging allows for integrated thermal management where heat-generating power elements and control elements are positioned in close proximity, enabling more effective heat dissipation pathways and reducing overall heat generation through optimized current paths.
Solution Approach 2:
The stacked three-dimensional arrangement creates vertical heat dissipation pathways in addition to horizontal paths. This dimensional change increases the surface area available for thermal management and allows heat to be conducted away from power elements through multiple routes, reducing temperature rise despite high switching speeds.
3Ease of manufacture
If conventional planar module design is used, then manufacturing is simpler, but power and control loop inductance is higher increasing electronic noise sensitivity
Solution Approach 1:
The patent employs a stacked modular design where circuit elements are arranged in vertical layers rather than a single planar layer. This dimensional change reduces parasitic inductance by minimizing current loop areas while maintaining manufacturing feasibility through standardized stacking and bonding processes suitable for power electronic fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design minimizes power and control loop inductance, reduces electronic noise sensitivity, and provides efficient thermal management, leading to improved performance and reliability of the power module.
Implementation Method 1
provides efficient thermal management
Data Source
AI summary
A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.