Stacked Vertical Power Module With Interconnects for High Power Density
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Solution Overview
Problem
Current electronic package technologies are unable to meet the increasing demand for high power and current densities required for advanced applications such as artificial intelligence computing and self-driving systems.
Innovation Solution
A stackable micro-electronic module design incorporating vertical interconnections made from conductive materials and coupled magnetic devices, which provide input/output pad connectivity between stacked modules and enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional electronic package technologies are used, then manufacturing simplicity is maintained, but power density and current capacity are insufficient for high power applications
Solution Approach 1:
The patent transitions from conventional planar electronic packages to a three-dimensional stacked architecture with vertical interconnects. Multiple substrates are stacked vertically with conductive interconnects extending through molding compounds, enabling increased power density by utilizing the vertical dimension for current flow and thermal management pathways.
Solution Approach 2:
The patent embeds multiple functional layers within a nested structure: substrates are embedded within molding compounds, which contain vertical interconnects, which in turn connect to additional stacked substrates. This nested arrangement allows compact integration of power, signal, and thermal management functions within a unified package structure.
2Power
If vertical interconnects with high aspect ratios are implemented, then current flow and power density are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces molding compounds as intermediary materials that encapsulate and support the vertical interconnects. These molding compounds provide mechanical support and alignment references during manufacturing, enabling the fabrication of high aspect ratio interconnects (1:1 to 10:1) without requiring extreme manufacturing precision. The molding compound acts as a mediator between the interconnect structure and the manufacturing process.
3Power
If multiple substrates are stacked vertically, then power density and thermal performance are improved, but device complexity increases
Solution Approach 1:
The patent designs substrates and interconnect structures that serve multiple functions simultaneously: electrical signal transmission, power delivery, and thermal conduction pathways. The vertical interconnects function as both electrical conduits and thermal management channels, reducing the need for separate dedicated structures and thereby managing complexity while achieving high power density.
4Power
If conductive materials are used for vertical interconnects, then electrical connectivity and current capacity are improved, but thermal management challenges increase
Solution Approach 1:
The patent implements localized thermal management by positioning substrates with dissipation characteristics at strategic locations within the stacked architecture. Different regions of the package have optimized thermal properties: substrates provide rigid thermal pathways, while molding compounds provide distributed thermal management. This local quality differentiation enables effective heat dissipation despite the high current capacity of conductive interconnects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables customizable configurations, optimal thermal performance, improved current flow, and increased power density, addressing the limitations of existing technologies.
Implementation Method 1
an electromagnet physically and electrically connected to the second side of the first substrate, the electromagnet electrically connected to the plurality of electronic components via one or more electrical connections through the first substrate
Implementation Method 2
a first plurality of vertical interconnects physically and electrically connected to a second side opposite the first side of the first substrate, the first plurality of vertical interconnects extending outwardly from the second side of the first substrate
Data Source
AI summary
An electronic assembly is disclosed. The electronic assembly can include a first integrated device package having a first substrate, a plurality of electronic components mounted to the first substrate, a first plurality of vertical interconnects connected to first substrate and extending outwardly, a first molding compound over at least portions of the plurality of electronic components, and an electromagnet connected to the first substrate. The electromagnet can be connected to the plurality of electronic components via one or more electrical connections. The electronic assembly can also include a second integrated device package having a second substrate, a second plurality of vertical interconnects connected to the second substrate, a second molding compound, and electrical terminals formed on a second side of the second substrate. The first and second vertical interconnects can be disposed between the first and second substrates.