Stacked Power Supply Module Layout for Discharge-Free Mass Spectrometry
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Solution Overview
Problem
Existing power supply modules face challenges in increasing output voltage and reducing noise while maintaining a compact size, which is essential for high-sensitivity analysis devices like mass spectrometers.
Innovation Solution
A power supply module design with multiple substrates overlapped at specific distances to prevent discharge and reduce noise, utilizing a multi-layer structure with optimized circuit spacing and noise reduction filters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the output voltage is increased and electrical characteristics are improved, then the performance of the power supply module is enhanced, but the size of the power supply module increases
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked configuration with multiple substrates positioned at different heights. The first substrate containing high voltage circuits is placed at a different vertical level than the second substrate containing low voltage circuits, effectively utilizing the vertical dimension to separate circuits while maintaining a compact footprint.
Solution Approach 2:
The power supply module is divided into multiple independent substrates: a first substrate for high voltage direct current circuits, a first substrate for high voltage alternating current circuits, and a second substrate for low voltage circuits. This segmentation allows each substrate to be optimized independently and reduces the overall size by distributing circuits across multiple layers.
2Reliability
If the distance between high voltage circuits and low voltage circuits is increased to prevent discharge, then safety is improved, but the size of the power supply module increases
Solution Approach 1:
Instead of increasing horizontal spacing between high voltage and low voltage circuits, the patent positions them at different vertical levels. The first high voltage substrate and the second low voltage substrate are separated in the vertical dimension, maintaining adequate discharge prevention distance while minimizing the horizontal footprint of the module.
Solution Approach 2:
The patent arranges substrates in a nested-like vertical stacking configuration where multiple substrates are positioned one above another within a compact enclosure. The first substrate, first high voltage substrate, and second substrate are nested in the vertical space, maximizing space utilization while maintaining required clearance distances.
Data Source
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AI summary
The performance of a power supply module is to be improved. The occurrence of discharge in the power supply module is to be prevented, and the size of the power supply module is to be reduced. In a power supply module, substrates are provided being stacked in a planar view. A low voltage circuit and a high voltage circuit are formed on a first substrate such that a distance is kept for preventing surface discharge, and a low voltage circuit is formed on a second substrate. A distance between a component of a high voltage alternating current circuit on the high voltage circuit and a component of the low voltage circuit is three times a shortest distance, at which space discharge does not occurs, between a component that constitutes a high voltage direct current circuit on the high voltage circuit and a component that constitutes the low voltage circuit.