Stacked Server Power Module Layout for Lower Transmission Loss
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Solution Overview
Problem
Traditional CPU power supplying architectures in servers suffer from high power loss due to long intermediate transmission paths and high transmission impedance, resulting in low working efficiency and reduced performance.
Innovation Solution
A power module design with power chips, input capacitors, and output inductors stacked vertically on a printed circuit board, connected via via holes to a load, reducing transmission paths and impedance, and integrating these components to minimize board area and enhance power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If power chips and output inductors are separated and located on the same horizontal plane as the load, then the multiphase power source can supply power to the load, but the transmission path becomes long, transmission impedance increases, and power loss becomes substantial
Solution Approach 1:
The patent transitions from a traditional horizontal plane layout to a three-dimensional stacked architecture. Power chips are mounted on the first PCB layer, output inductors on the second PCB layer, and the load on the third PCB layer, connected via vertical via holes. This dimensional change dramatically shortens the current transmission path and reduces transmission impedance, thereby minimizing power loss while maintaining power supply capability.
Solution Approach 2:
The patent integrates multiple components (power chips, output inductors, and load) into a compact stacked structure within a single module. By combining these previously separate components into a vertically integrated assembly, the design reduces the overall transmission distance and eliminates the need for long horizontal traces, thus reducing power loss without compromising the power supply function.
2Adaptability or versatility
If power chips and output inductors are separated and located on the same horizontal plane, then the power source can function, but the transmission impedance becomes high, reducing working efficiency
Solution Approach 1:
The patent employs a three-dimensional stacked configuration where power chips, output inductors, and the load are arranged on different PCB layers and connected through vertical via holes. This vertical integration dramatically reduces transmission impedance by minimizing the current path length, thereby significantly improving working efficiency while preserving the adaptability and functionality of the power source.
Solution Approach 2:
The patent divides the power supply system into distinct functional segments (power chips on one layer, output inductors on another, load on a third) connected through optimized vertical pathways. This segmentation allows each component to be positioned optimally for its function while maintaining short transmission paths, thus enhancing both working efficiency and functional adaptability.
3Reliability
If components are arranged horizontally on the same plane, then the power source can supply power, but the transmission path is long, causing substantial power loss
Solution Approach 1:
The patent implements a vertical stacking architecture across three PCB layers, connecting power chips, output inductors, and the load through via holes. This three-dimensional arrangement dramatically shortens the current transmission path compared to horizontal layout, reducing resistive power loss while maintaining stable power supply through reliable vertical interconnections.
Solution Approach 2:
The patent uses via holes as intermediary connection elements to establish low-impedance vertical pathways between different PCB layers. These via holes serve as efficient current conduits, replacing long horizontal traces and minimizing power loss while ensuring reliable power transmission from the power chips through the inductors to the load.
4Loss of energy
If a vertical stacked architecture is implemented, then transmission path is shortened and power loss reduced, but component arrangement complexity increases
Solution Approach 1:
The patent adopts a vertical stacked architecture that organizes power chips, output inductors, and the load on three separate PCB layers connected via via holes. While this increases manufacturing complexity compared to planar layouts, it dramatically reduces power loss by minimizing transmission path length. The modular layered structure actually simplifies thermal management and signal routing compared to dense horizontal arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces power consumption, improves energy efficiency, and optimizes server system performance by minimizing transmission loss and board area, while promoting resource utilization and signal quality.
Implementation Method 1
output ends of the plurality of output inductors are connected to a load through a via hole in a third printed circuit board to supply power to the load
Data Source
AI summary
The present application discloses a power module and a server. The power module includes a plurality of power chips, a plurality of input capacitors, a plurality of output inductors, and a first printed circuit board. The plurality of power chips are spaced apart on an upper surface of the first printed circuit board, and input ends of the plurality of power chips are connected to an input power source. The plurality of input capacitors are fixedly arranged at the first printed circuit board. The plurality of output inductors are stacked with the plurality of power chips in a vertical direction through the first printed circuit board. Output ends of the plurality of output inductors are connected to a load in a third printed circuit board to supply power to the load. The plurality of output inductors are located on a lower surface of the third printed circuit board.