Stacked Power Module Assembly for Thermal Dissipation
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Solution Overview
Problem
Existing power modules face challenges in achieving high peak and full-load efficiency while maintaining a small areal footprint and robust electrical interconnections, particularly in applications requiring high voltage and current handling.
Innovation Solution
A semiconductor assembly comprising a carrier with surface mount packages and discrete inductors, where the discrete inductors are thermally and electrically coupled to the surface mount packages, forming a power stage with the inductors acting as both electrical and heat sink components, enhancing efficiency and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If discrete inductors are mounted over surface mount packages with thermal coupling, then thermal dissipation and electrical connectivity are improved, but device complexity increases
Solution Approach 1:
The inductor structure is merged with the surface mount package to form an integrated power module. The inductor is positioned directly over the surface mount package and thermally coupled to its upper side, combining electrical connectivity and thermal management functions into a single integrated assembly, thereby improving thermal dissipation while managing device complexity through functional integration
Solution Approach 2:
The inductor serves multiple functions: it provides electrical connectivity through its leads connected to the surface mount package terminals, and simultaneously acts as a heat sink component through thermal coupling to the upper side of the surface mount package. This multi-functionality addresses both electrical and thermal requirements without requiring separate dedicated components
2Reliability
If surface mount packages are mounted on carrier with lower surface terminals connecting to contact pads, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The surface mount packages are pre-mounted on the carrier with their lower surface terminals establishing electrical connections to the contact pads before the inductors are installed. This preliminary assembly step ensures robust electrical connectivity is established early in the manufacturing process, facilitating subsequent inductor mounting and simplifying the overall assembly sequence
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor assembly achieves high efficiency and effective thermal dissipation, addressing the need for compact and high-performance power modules with improved electrical and thermal connectivity.
Implementation Method 1
the first and second discrete inductors are respectively thermally coupled to the upper sides of the first and second surface mount packages
Data Source
AI summary
A semiconductor assembly includes a carrier including a dielectric substrate and a plurality of contact pads disposed on an upper surface of the carrier, first and second surface mount packages mounted on the carrier, first and second discrete inductors respectively mounted over the first and second surface mount packages, wherein the first and second surface mount packages each comprise lower surface terminals that face and electrically connect with the contact pads from the carrier, wherein the first and second surface mount packages each comprise an upper side that faces away from the carrier, and wherein the first and second discrete inductors are respectively thermally coupled to the upper sides of the first and second surface mount packages.