Stacked Power Module Layout for High-Density Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power modules face challenges in achieving high-power density, high-efficiency, and effective heat dissipation in space-constrained environments due to increased current demands from modern GPUs and CPUs, particularly in high current and low voltage applications.
Innovation Solution
A two-stage power distribution system is implemented, comprising a first power module with input and power pads on different surfaces and a second power module with signal and output pads on different surfaces, stacked vertically, utilizing a switched tank converter and multi-phase voltage regulator, reducing voltage levels and impedance, and incorporating a heat spreader for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If higher current is used to achieve better processor performance, then power delivery capability is improved, but heat conduction becomes more challenging
Solution Approach 1:
The patent transitions from planar power module layout to a three-dimensional stacked configuration. The first power module and second power module are arranged vertically one above the other, with input pads on the top surface of the first module and output pads on the bottom surface of the second module. This vertical stacking reduces the horizontal footprint while maintaining high power delivery capability, and enables more effective thermal management by separating power delivery paths from heat dissipation paths in different spatial dimensions.
2Volume of moving object
If smaller size is used to meet space constraints, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs vertical stacking to reduce the horizontal footprint of the power module while maintaining effective heat dissipation. By arranging the first power module and second power module in a vertical configuration with input pads on the top and output pads on the bottom, the design achieves compactness in the planar dimension while preserving thermal management capability through three-dimensional heat distribution and dissipation pathways.
3Ease of manufacture
If conventional planar power module layout is used, then manufacturing is simplified, but power density and heat dissipation are compromised
Solution Approach 1:
The patent implements a vertical stacked architecture where the first power module and second power module are positioned one above the other. The input pads are located on the top surface of the first module and the output pads on the bottom surface of the second module, creating a compact three-dimensional power delivery system. This configuration increases power density by utilizing vertical space while maintaining manufacturing feasibility through standardized module stacking and connection techniques.
Data Source
AI summary
A power module includes a first power module and a second power module arranged below the first power module. The first power module includes at least one input pad configured to receive an input voltage and at least one power pad configured to provide an intermediate voltage. The at least one input pad is mounted on a top surface of the first power module, and the at least one power pad is mounted on a bottom surface of the first power module. The second power module includes at least one signal pad configured to receive the intermediate voltage and at least one output pad configured to provide an output voltage. The at least one signal pad is mounted on a top surface of the second power module, and the at least one output pad is mounted on a bottom surface of the second power module.