Stacked Isolated Power Module Substrate for Compact Heat Dissipation
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Solution Overview
Problem
Microelectronic devices face challenges in size reduction and thermal management due to the limitations of interconnect lengths and heat dissipation in multi-chip modules.
Innovation Solution
The use of thermally conductive materials and thermal shunts in microelectronic devices to efficiently connect and dissipate heat from multiple components, with thermal shunts strategically positioned to enhance heat transfer paths through die pads and leads, allowing for reduced device size and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple components are stacked vertically to reduce device size, then the area of the microelectronic device is reduced, but thermal management becomes more difficult due to heat accumulation in the stacked configuration
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by stacking thermal shunts vertically beneath the die pad. This vertical stacking allows heat to be extracted in the depth dimension rather than only in the planar direction, enabling effective thermal management in compact stacked configurations where components are arranged vertically to reduce footprint area.
Solution Approach 2:
The thermal shunt is divided into multiple discrete thermal shunts (first thermal shunt, second thermal shunt, etc.) that can be independently positioned and configured. Each thermal shunt can be strategically placed to serve specific heat-generating components, allowing optimized heat extraction paths for each component while maintaining compact overall device dimensions.
2Temperature
If thermal shunts are strategically positioned closer to component centers to enhance heat transfer, then thermal management efficiency is improved, but device complexity increases due to precise positioning requirements
Solution Approach 1:
Different thermal shunts are positioned at different locations relative to different components based on their specific thermal requirements. The first thermal shunt is positioned closer to the center of the first component, while the second thermal shunt is positioned closer to the center of the second component. This localized optimization allows each thermal shunt to efficiently serve its associated component without requiring complex global positioning systems.
Solution Approach 2:
Multiple thermal shunts are merged into a unified stacked configuration beneath the die pad, sharing common structural support and integration pathways. This merging approach allows precise positioning of individual thermal shunts while utilizing shared manufacturing processes and structural elements, thereby reducing overall device complexity despite the need for precise individual positioning.
3Temperature
If thermally conductive materials are used to connect components to die pad, then heat dissipation is improved, but device size increases due to additional material layers
Solution Approach 1:
The thermal shunts are nested vertically beneath the die pad in a stacked configuration, with multiple thermal shunts arranged in the depth dimension rather than occupying additional planar space. This nesting approach allows thermally conductive materials to be effectively utilized for heat dissipation while containing the device volume, as the thermal management structures are embedded within the existing vertical footprint rather than expanding the planar dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides efficient thermal paths and reduces the size of microelectronic devices while effectively managing heat dissipation, improving performance and reliability.
Implementation Method 1
A first component is directly attached to the first surface of the die pad through a first thermally conductive material. A second component is directly attached to the second surface of the die pad through a second thermally conductive material.
Implementation Method 2
a first thermal shunt connecting the die pad to a first lead of the leads, and a second thermal shunt connecting the die pad to a second lead
Data Source
AI summary
A microelectronic device includes a die pad having a first surface and a second, opposite, surface. A first component is directly attached to the first surface of the die pad through a first thermally conductive material. A second component is directly attached to the second surface of the die pad through a second thermally conductive material. At least a portion of the second component overlaps at least a portion of the first component. The microelectronic device further includes a first thermal shunt connecting the die pad to a first lead, and a second thermal shunt connecting the die pad to a second lead. The first thermal shunt is closer to a center of the first component than to a center of the second component. The second thermal shunt is closer to a center of the second component than to a center of the first component.