Stacked Power Supply Module Layout to Prevent Substrate Warping
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Solution Overview
Problem
Existing power supply modules face challenges in achieving high integration and miniaturization due to the weight and deformation issues of upper substrates when additional electronic components are mounted, leading to poor electrical connections.
Innovation Solution
The use of multiple second substrates or submodules positioned perpendicular to a principal surface of a first substrate allows for the distribution and mounting of electronic components on both surfaces, enhancing the strength and flexibility of the module design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If additional electronic components are mounted on an upper substrate to achieve high integration, then the number of electronic components increases, but the upper substrate deforms or warps due to excessive weight
Solution Approach 1:
The patent transitions from a single-plane substrate layout to a three-dimensional stacked architecture. Multiple substrates are arranged vertically with lower substrates supporting upper substrates, enabling electronic components to be distributed across multiple height levels. This dimensional change allows increased component density without overloading any single substrate, as the load is distributed across multiple support structures in the vertical dimension.
Solution Approach 2:
The patent divides the integrated circuit into multiple independent substrates (first substrate, second substrate, third substrate) rather than using one large substrate. Each substrate carries a portion of the electronic components and supports the ones above it. This segmentation reduces the weight and stress on individual substrates, preventing deformation while maintaining high integration through vertical stacking.
2Area of stationary object
If the area of the upper substrate is increased to accommodate more electronic components, then more components can be mounted, but the substrate strength becomes insufficient
Solution Approach 1:
Instead of expanding substrate area in the horizontal plane which compromises strength, the patent utilizes the vertical dimension by stacking multiple substrates. This allows the system to accommodate more components by increasing the number of substrates in the vertical direction rather than enlarging individual substrate areas, thereby maintaining adequate strength-to-area ratio.
Solution Approach 2:
The patent segments the component distribution across multiple substrates of moderate size rather than using one large substrate. Each substrate maintains a reasonable area that preserves its structural strength, while the collective arrangement of multiple substrates provides the total component capacity equivalent to a much larger single substrate.
3Adaptability or versatility
If more electronic components are added to the power supply module, then functionality and integration are improved, but poor electrical connections occur due to substrate deformation
Solution Approach 1:
By arranging substrates vertically in a stacked configuration, the patent enables additional electronic components to be mounted on upper substrates without causing the deformation that plagues single-plane layouts. The vertical stacking geometry inherently reduces bending moments and warping, thereby maintaining reliable electrical connections while enhancing functionality through increased component count.
Solution Approach 2:
The patent segments the electronic component layout across multiple substrates, where each substrate is structurally optimized to support its own weight plus the substrates above it. This segmentation prevents the excessive deformation that occurs in single large substrates, ensuring that electrical connections between components and substrate traces remain reliable while achieving enhanced functionality through modular component distribution.
Data Source
AI summary
A power supply module includes a first substrate; a control IC, a capacitor, a first electronic component, a second electronic component, a third electronic component and a fourth electronic component on a principal surface of the first substrate; a first submodule including a second substrate above the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component and including a fifth electronic component, a sixth electronic component, and a seventh electronic component on a principal surface of the second substrate; and a resin covering an upper portion of the first submodule.