Stacked Power Supply Chip with Integrated Capacitor for Voltage Stabilization
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Solution Overview
Problem
The challenge in semiconductor device manufacturing lies in the restricted chip area and spatial constraints due to the presence of a power stabilizing capacitor in multi-chip packages, which increases production costs and reduces yield.
Innovation Solution
The solution involves stacking a power supply chip with a semiconductor capacitor on top of the semiconductor chip, allowing for voltage stabilization without the need for a separate capacitor on the package board, thereby relieving spatial restrictions and enabling more efficient bonding pad arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a power stabilizing capacitor is arranged on the package board in multi-chip packages, then voltage stabilization is achieved, but the occupied chip area increases and production cost increases
Solution Approach 1:
The patent combines the power supply function and capacitor function into a single integrated power supply chip. The power supply chip includes both the power supply circuit and the capacitor, eliminating the need for separate capacitor components on the package board. This merging reduces the total occupied area while maintaining voltage stabilization functionality.
Solution Approach 2:
The power supply chip serves multiple functions: it provides power supply, voltage stabilization through integrated capacitor, and electrical connection between chips. By making the power supply chip universal and multi-functional, the design eliminates dedicated capacitor space requirements and reduces overall package area.
2Reliability
If a power stabilizing capacitor is arranged on the package board, then voltage stabilization is achieved, but the distance between bonding wire and board circuit pattern shortens which lowers yield
Solution Approach 1:
The patent extracts the capacitor from the package board and relocates it onto the power supply chip. This extraction eliminates the proximity issues between bonding wires and board circuit patterns, as the capacitor is now integrated on the chip itself rather than being a separate component on the board, thereby improving production yield.
3Manufacturing precision
If fine patterning processes are used for power supply chip, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
By merging the power supply circuit and capacitor into a single integrated chip, the patent reduces the overall complexity of fine patterning requirements. The integrated design allows for more straightforward manufacturing processes compared to creating separate fine-patterned components, thereby reducing production costs while maintaining necessary manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the occupied chip area, improves production yield, and allows for a multi-chip package semiconductor device to be produced at a lower cost by eliminating the need for additional capacitors and optimizing bonding wire connections.
Implementation Method 1
a power supply chip having a capacitor, wherein the capacitor is used to stabilize the voltage applied to the semiconductor chip
Data Source
AI summary
A semiconductor device comprises a board; a semiconductor chip; a memory controller operative to control the semiconductor chip; and a power supply chip having a capacitor. The semiconductor chip is stacked on the board. The memory controller and the power supply chip are stacked on the semiconductor chip. The capacitor is used to stabilize the voltage applied to the semiconductor chip.