Stacked Processor Modules with Board-to-Board Connectors
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Solution Overview
Problem
Existing multiprocessor systems face challenges in scalability and cost due to unpredictable future functionality needs, leading to either excess or insufficient CPU modules, and require varied configurations for processing unsymmetrical signals, increasing manufacturing and maintenance costs.
Innovation Solution
A multiprocessor system with stacked CPU modules connected via board-to-board connectors and a baseboard using a specific bus specification like PCI, allowing identical CPU module configurations and coordinated operations through defined routes, facilitating extensibility and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If CPU modules are reserved in advance to satisfy future multitask requirements, then the system's adaptability is improved, but the cost increases due to excess modules
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of CPU modules on a baseboard to a three-dimensional stacked configuration. By stacking CPU modules vertically along the Z-axis, the system achieves higher density and better scalability without proportionally increasing the footprint area. This dimensional change allows more CPU modules to be integrated into a compact space, resolving the contradiction between system extensibility and the quantity of modules required.
2Device complexity
If CPU modules are laid out on a baseboard, then the system structure is simple, but the space utilization is low and extensibility is limited
Solution Approach 1:
The patent implements a nested structure where CPU modules are stacked vertically one on top of another, with each module containing its own processor and peripheral circuits. The board-to-board connectors enable electrical connections between nested layers, creating a compact three-dimensional integration. This nesting approach maximizes space utilization by using the vertical dimension, allowing more functionality to be packed into a smaller overall footprint while maintaining a relatively simple modular structure.
3Adaptability or versatility
If CPU modules are configured differently to process unsymmetrical signals, then the system's functionality is improved, but the manufacturing and maintenance costs increase
Solution Approach 1:
The patent introduces asymmetry through the routing layer configuration rather than CPU module differentiation. The board-to-board connectors contain separate routing layers that handle unsymmetrical signal transmission (request/reply signals, interrupt signals, clock signals, initialization device select signals, and reset signals) between identical CPU modules. This approach maintains hardware symmetry for manufacturing simplicity while achieving functional asymmetry through software-configurable routing paths, thereby resolving the contradiction between signal processing capability and manufacturing cost.
4Productivity
If more CPU modules are integrated, then the processing capability is improved, but the heat dissipation becomes more difficult
Solution Approach 1:
The patent segments the multiprocessor system into multiple independent but identical CPU modules, each with its own processor and peripheral circuits. This segmentation allows for distributed heat generation across multiple smaller units rather than one large concentrated heat source. The modular stacked architecture enables better thermal management by separating heat-generating components across different vertical layers, facilitating heat dissipation through the stack structure and reducing thermal interference between modules, thus maintaining processing capability while improving heat dissipation.
Data Source
AI summary
A multiprocessor system is provided, comprising a baseboard, for arranging peripheral equipments; and a plurality of processor modules, each equipped with a processor and a board-to-board connector; wherein the plurality of processor modules are stacked up, with board-to-board connectors being electrically connected between the processor modules and between the processor modules and the baseboard; the processors communicate with the peripheral equipments in accordance with a specific bus specification; and the operations of the plurality of processor modules are coordinated by routes provided between the processor modules and between the processor modules and the baseboard.