Stacked Receptacle Connector Cage for Heat Sink Density
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Solution Overview
Problem
Communication systems face challenges with high heat generation from electronic packages, leading to increased system size and reduced component density due to the need for larger heat sinks, which restricts the number of components that can be utilized.
Innovation Solution
A receptacle connector assembly with a tall, multi-layered receptacle cage design that allows for stacked module channels, enabling a compact footprint while accommodating a taller heat sink for improved heat dissipation and increased component density by using board-mounted and cable-mounted receptacle modules to connect plug modules to the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a larger heat sink is used to dissipate heat from the electronic package, then heat dissipation capacity is improved, but the system footprint increases and component density decreases
Solution Approach 1:
The patent transitions from a conventional horizontal layout to a vertical stacked configuration, arranging multiple module channels (first, second, and third module channels) vertically above each other within the receptacle cage. This dimensional change allows the heat sink to extend vertically rather than horizontally, improving heat dissipation capacity while maintaining a compact system footprint.
2Temperature
If a larger heat sink is used to dissipate heat from the electronic package, then heat dissipation capacity is improved, but the number of electrical components that can be utilized decreases
Solution Approach 1:
By stacking module channels vertically, the patent creates additional spatial dimensions for component placement. The receptacle cage accommodates multiple receptacle modules (first, second, and third receptacle modules) in different vertical levels, each capable of mating with plug modules. This vertical arrangement increases component density and system versatility without compromising heat dissipation capacity.
3Area of stationary object
If a compact footprint is achieved by reducing heat sink size, then system size is reduced, but heat dissipation capacity decreases
Solution Approach 1:
The patent resolves this contradiction by reorienting the heat sink from a horizontal to a vertical configuration. The heat sink extends vertically within the receptacle cage, utilizing the vertical space created by the stacked module channels. This allows the system to maintain a compact horizontal footprint while achieving sufficient heat dissipation capacity through increased vertical height of the heat sink.
4Adaptability or versatility
If more electrical components are added to increase component density, then system versatility is improved, but the system footprint increases
Solution Approach 1:
The patent accommodates multiple electrical components by stacking them vertically within the receptacle cage. The first, second, and third module channels are arranged vertically, allowing corresponding receptacle modules to be positioned at different vertical levels. This vertical stacking enables high component density and system versatility while maintaining a compact horizontal footprint, as all components are contained within the vertical envelope of the receptacle cage.
Data Source
AI summary
A receptacle connector assembly includes a receptacle cage having cage walls defining first, second, and third module channels in a stacked arrangement. The cage walls include a top wall, a first side wall, a second side wall, a first separator panel, and a second separator panel. The first and second side wall extend along opposite sides of the first, second and third module channels. The first separator panel is located between the first and second module channels. The second separator panel is located between the second and third module channels. The receptacle connector assembly includes a first receptacle module in the first module channel for mating with a first plug module, a second receptacle module in the second module channel for mating with a second plug module, and a third receptacle module in the third module channel for mating with a third plug module.