Stacked Reflow Soldering Chambers for High Throughput in Less Floor Space
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Solution Overview
Problem
Existing soldering devices require significant space for multiple process chambers, limiting their efficiency and scalability, especially in factory settings where vertical expansion is more feasible than horizontal expansion.
Innovation Solution
A device with stacked process chambers that allow for parallel processing of multiple assemblies with a temporal offset, reducing space requirements while maintaining efficient thermal management and soldering quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple process chambers are arranged horizontally for parallel processing, then productivity increases, but the device occupies excessive floor space
Solution Approach 1:
The patent transitions from horizontal arrangement of process chambers to vertical stacking, utilizing the third dimension (height) to accommodate multiple process chambers. This allows parallel processing of multiple assemblies simultaneously while minimizing floor space occupation, as the chambers are arranged one above the other rather than side by side.
2Area of stationary object
If process chambers are stacked vertically, then space requirements are reduced, but thermal management and temperature control become more complex
Solution Approach 1:
The patent divides the thermal management system into independent segments, with each process chamber equipped with its own heating and cooling mechanisms. This segmentation allows each chamber to be controlled independently, simplifying the overall thermal management despite the vertical stacking configuration.
Solution Approach 2:
The patent implements localized thermal control within each process chamber, providing tailored heating and cooling conditions for each chamber based on its specific processing requirements. This local quality approach ensures that thermal management is optimized for each chamber while maintaining simplicity in the overall system architecture.
3Adaptability or versatility
If assemblies are processed with temporal offset in stacked chambers, then manufacturing flexibility increases, but process coordination complexity increases
Solution Approach 1:
The patent implements feedback control mechanisms that monitor the processing state of assemblies in each chamber and automatically adjust the timing and coordination of processes. This feedback system manages the temporal offsets between chambers, ensuring proper synchronization while maintaining manufacturing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves efficient soldering of multiple assemblies with reduced space requirements, enabling higher throughput and flexibility in manufacturing processes while maintaining precise thermal control.
Implementation Method 1
a connection is made by applying thermal energy to the assembly, whereby a liquid phase is created by melting a solder
Implementation Method 2
The device used is designed to achieve a defined temperature control of the assembly or of the components and the solder in such a way that melting of the solder is achieved
Data Source
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AI summary
The invention relates to a device (1) for soldering, in particular for reflow soldering, at least one assembly (2), comprising a process chamber device (5, 5', 50, 50') comprising at least two process chambers (6, 6', 6'', 6''', 29, 29') for preparing a soldering process and/or for carrying out a soldering process and/or for post-processing a soldering process, wherein the at least two process chambers (6, 6', 6'', 6''', 29, 29') are arranged one above the other, in particular in a stack-like manner.