Stacked Voltage Regulator Package Layout for Lower Power Path Loss

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Solution Overview

Problem

Long power routing paths through substrates in electronic devices lead to significant voltage drops, degrading performance and requiring higher input voltage, which complicates power regulation and miniaturization.

Innovation Solution

A stacked structure of passive components within the electronic device, where a first passive component is disposed under a power regulating component and a second passive component is stacked on top, reducing the power path length and enabling lower supply power while maintaining efficient power regulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If power routing path through substrate is used, then power can be delivered to components, but voltage drop increases significantly

Engineering Contradiction:
Improvepower deliveryVSAvoidvoltage drop
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

The patent transitions from planar power routing through substrate to three-dimensional stacked architecture where passive components are vertically positioned directly over the power regulating device. This dimensional change creates a direct vertical power path that eliminates long horizontal routing paths through the substrate, thereby reducing voltage drop while maintaining power delivery capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If power regulating device is integrated within package, then size of electronic device is miniaturized, but power routing path becomes longer

Engineering Contradiction:
Improvedevice sizeVSAvoidpower routing path
Core Design Contradiction:
Volume of moving objectVSLength of stationary object

Solution Approach 1:

The patent implements nesting by positioning passive components (inductor and capacitor) directly on top of the power regulating device in a stacked configuration. This nested arrangement allows power routing paths to be contained within the vertical footprint of the power regulating device itself, eliminating the need for extended horizontal routing paths through the substrate while maintaining integrated package miniaturization.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If passive components are formed as monolithic components, then manufacturing efficiency is increased, but integration complexity arises

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidintegration complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the power management system into distinct functional modules: a power regulating device and separate passive components (inductor and capacitor). These segmented components are then integrated in a stacked configuration where each component can be manufactured independently with optimized processes, yet they function together as a unified power management system. This segmentation enables manufacturing efficiency while managing integration complexity through standardized interfaces and vertical stacking.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12176305B2Semiconductor package with integrated voltage regulator device and separate bridge die
Publication Date: 2024.12.24 ADVANCED SEMICON ENG INC
  • US12176305B2 patent drawing
  • US12176305B2 patent drawing
  • US12176305B2 patent drawing

AI summary

An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.