Stacked Power Regulator Layout for SiP Voltage Drop Reduction
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Solution Overview
Problem
Long power routing paths in System-in-Package (SiP) technology lead to significant voltage drops, degrading performance and requiring efficient power regulation solutions.
Innovation Solution
Incorporating a power regulator above the electronic component with a passive component in the electrical path and a heat sink for efficient heat dissipation, allowing power to be received laterally without passing through the component, thereby reducing power loss and enhancing heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power routing path is extended through substrate and package, then power can be delivered to components, but voltage drop increases significantly
Solution Approach 1:
The patent transitions from traditional planar power routing through substrate to a three-dimensional stacked architecture where the power regulator is positioned vertically above the electronic component. This dimensional change creates a shorter, more direct power delivery path, reducing the routing length and minimizing voltage drops while maintaining effective power delivery to the component.
Solution Approach 2:
The patent introduces an intermediary power regulator structure positioned between the power source and the electronic component. This intermediary component regulates and optimizes power delivery, reducing energy losses during transmission while ensuring stable voltage supply to the component, thereby addressing both power delivery and voltage drop issues.
2Loss of energy
If power regulator is positioned above electronic component, then power routing path is shortened, but device structure becomes more complex
Solution Approach 1:
The patent merges multiple functions into the power regulator structure, which simultaneously serves as a power regulation component and a structural element that defines the stacked architecture. By combining power regulation, routing, and structural support functions into a single integrated component, the design reduces overall device complexity despite the three-dimensional configuration.
Solution Approach 2:
The power regulator is designed with multi-functionality, serving not only as a power regulation device but also as a structural platform that supports the electronic component and provides thermal management interfaces. This universal design approach consolidates multiple functions into one component, minimizing the increase in device complexity while achieving shortened power routing paths.
3Temperature
If heat sink is added to cover electronic component and power regulator, then heat dissipation is improved, but device volume increases
Solution Approach 1:
The heat sink is designed with a nested structure that accommodates the power regulator within its volume, allowing the heat dissipation component to enclose and thermally interface with the power-regulating element. This nesting arrangement enables efficient heat transfer from the power regulator to the heat sink without requiring additional external space, thereby improving heat dissipation while minimizing device volume increase.
Solution Approach 2:
The heat sink employs thin-film thermal interface materials and streamlined shell structures that provide effective heat dissipation with minimal thickness. These thin-film solutions allow thermal management functionality to be integrated into the existing device footprint without significantly increasing overall volume, while still achieving improved heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes voltage drops, saves power, and improves heat dissipation efficiency, allowing for more efficient power delivery and increased signal transmission capabilities.
Implementation Method 1
The heat sink is configured to dissipate heat from the first electronic component and the first power regulator to external of the electronic device
Implementation Method 2
The heat sink is configured to dissipate heat from the first electronic component and the first power regulator to external of the electronic device
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.