Stacked Substrate Treatment Lines for Parallel Resist Processing
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Solution Overview
Problem
Conventional substrate treating apparatuses face limitations in throughput due to the need for multiple transporting steps and the challenge of reducing the number of main transport mechanisms, which increases the footprint and complexity of the apparatus.
Innovation Solution
The apparatus is designed with multiple substrate treatment lines arranged vertically, each equipped with multiple main transport mechanisms and treating units, allowing for parallel processing and efficient substrate transfer between adjacent lines without increasing the footprint, along with gas supply and exhaust systems to maintain cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple main transport mechanisms are employed to improve throughput, then productivity increases, but device complexity and footprint enlarge
Solution Approach 1:
The patent transitions from horizontal arrangement of multiple transport mechanisms to vertical arrangement of treatment lines. Multiple treatment lines are stacked vertically with each line having its own transport mechanism, allowing parallel processing without increasing horizontal footprint. This dimensional change enables throughput improvement while maintaining compact apparatus size.
Solution Approach 2:
The apparatus is divided into multiple independent treatment lines, each capable of processing substrates separately. Each treatment line includes its own transport mechanism and treating units, allowing parallel operation. This segmentation enables throughput multiplication while keeping each line's complexity manageable.
2Productivity
If multiple main transport mechanisms are added to increase throughput, then productivity improves, but the footprint of the apparatus enlarges
Solution Approach 1:
The patent utilizes vertical stacking of treatment lines instead of horizontal expansion. Multiple transport mechanisms are arranged in different vertical levels, allowing substrates to be processed in parallel while maintaining a compact horizontal footprint. The vertical arrangement enables throughput improvement without proportionally increasing the apparatus footprint.
3Productivity
If the number of transporting steps is reduced for a single main transport mechanism, then throughput improves, but the treating capability is limited
Solution Approach 1:
The apparatus is segmented into multiple treatment lines, each with complete treating capabilities including coating units, heat-treating units, and developing units. Each line can independently process substrates through all necessary treatment steps, providing full treating capability while enabling parallel processing for improved throughput.
Solution Approach 2:
Each treatment line is designed as a universal processing unit capable of performing multiple treatment operations (coating, heating, developing). This multi-functionality ensures that each line can handle complete substrate processing independently, maintaining adaptability while enabling parallel throughput improvement.
Data Source
AI summary
A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.