Stacked Resistor Capacitor Component Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing composite electronic components with integrated resistor and capacitor elements face limitations in design freedom due to constraints in processing difficulty, electrical characteristics, and circuit configuration, primarily because the resistor body is formed directly on the capacitor body or requires identical shapes and dimensions for the components, limiting their use in various circuits.
Innovation Solution
A composite electronic component design featuring a resistor device with an insulating base and a capacitor device mounted in a heightwise direction, where the resistor body is positioned between conductive layers on the insulating base, allowing for independent electrical connections and flexible design without the need for identical shapes or dimensions, enabling increased design and manufacturing freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the resistor body is formed directly on the capacitor body, then the composite electronic component achieves high integration, but the processing difficulty increases and design freedom decreases
Solution Approach 1:
The invention divides the composite electronic component into separate functional modules: a capacitor element and a resistor element, each with their own terminal electrodes. This segmentation allows independent fabrication and assembly of each component, reducing processing difficulty while maintaining high integration through subsequent mounting and electrical connection.
2Area of moving object
If the resistor body is formed directly on the capacitor body, then integration is achieved, but the resistor body's electrical characteristics are constrained by the capacitor body's size and electrode shape
Solution Approach 1:
By separating the resistor and capacitor into independent elements with separate terminal electrodes, each component can be designed with optimal dimensions and electrical characteristics without being constrained by the other component's geometry, thereby increasing design freedom while maintaining integration.
Solution Approach 2:
The invention transitions from a two-dimensional planar integration (resistor formed on capacitor surface) to a three-dimensional stacked configuration with vertical stacking of elements and terminal electrodes, allowing independent optimization of each component's electrical characteristics while achieving high integration.
3Area of moving object
If identically shaped and dimensioned chip type devices are stacked, then integration is achieved, but the electrical characteristics are subject to considerable constraints
Solution Approach 1:
The invention employs asymmetric design where the resistor element and capacitor element can have different shapes, sizes, and terminal electrode configurations according to their respective electrical characteristic requirements, rather than forcing identical geometries on both components.
Solution Approach 2:
The terminal electrode structure is designed to accommodate both the capacitor element and resistor element with different geometries, providing a universal mounting and electrical connection interface that supports diverse component configurations and circuit designs.
4Ease of manufacture
If the composite electronic component is limited to parallel connection configuration, then manufacturing is simplified, but the degree of freedom in circuit design is significantly limited
Solution Approach 1:
The invention provides a dynamic and flexible electrical connection architecture where the terminal electrodes can be configured to achieve either parallel or series connection between the capacitor and resistor elements, allowing the same physical structure to serve multiple circuit design requirements without increasing manufacturing complexity.
Data Source
AI summary
A composite electronic component includes a capacitor device and a resistor device disposed on one another in a heightwise direction. The capacitor device includes a capacitor body, a first external electrode, and a second external electrode. The resistor device includes a base portion, a resistor body, a first upper surface conductor, a second upper surface conductor, a first lower surface conductor, a second lower surface conductor, a first end surface connection conductor, and a second end surface connection conductor. An upper surface of the base portion of the resistor device faces a lower surface of the capacitor body of the capacitor device, the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.