Stacked Resonant Structures for Wireless Power Efficiency
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Solution Overview
Problem
Existing wireless charging systems face inefficiencies due to the use of separate capacitors and inductive coils, which result in higher energy loss during power transfer.
Innovation Solution
The implementation of stacked resonant structures with parallel-coupled inductance and capacitance, integrated into a magnetic core with C-shaped conductive layers and ceramic layers, reduces energy loss by integrating coils and capacitors, enhancing both inductive and capacitive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If separate capacitors and inductive coils are used to transfer wireless power, then the system can achieve basic power transmission, but energy loss increases during power transfer
Solution Approach 1:
The patent combines separate capacitors and inductive coils into an integrated stacked resonant structure where capacitor plates are formed between adjacent conductive layers separated by dielectric layers, and inductive windings are formed around the stacked structure. This merging reduces the number of discrete components and minimizes energy loss through improved coupling and reduced parasitic effects.
Solution Approach 2:
The patent employs composite structures combining conductive layers (copper or aluminum), dielectric layers (ceramic or polymer), and magnetic core materials. This composite approach optimizes both capacitive and inductive properties while minimizing energy loss through carefully selected material properties and configurations.
2Loss of energy
If stacked resonant structures with integrated coils and capacitors are used, then energy loss is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the resonant structure into discrete stacked layers, each with specific functions (conductive layers for capacitance, dielectric layers for insulation, magnetic core for inductance). This segmentation allows for modular manufacturing and assembly, reducing overall manufacturing complexity despite the integrated design.
Solution Approach 2:
The stacked resonant structure serves multiple functions simultaneously: it provides both capacitive and inductive properties, acts as a resonant circuit element, and enables wireless power transmission. This multi-functionality reduces the need for separate components and simplifies the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes energy loss and improves the efficiency of wireless power transfer by scaling capacitance without affecting inductance, enabling more effective power transmission.
Implementation Method 1
The coil of the portable electronic device receives alternating-current wireless power signals from a coil in the wireless power transmitting device
Implementation Method 2
The wireless power transmitting and receiving devices convey wireless power using stacked resonant structures
Data Source
AI summary
A wireless power system has wireless power transmitting and receiving devices. The transmitting and receiving devices convey wireless power using stacked resonant structures. The stacked resonant structures are self-resonant and have a parallel-coupled inductance and capacitance. The structures include a magnetic core having a central post and stacked ceramic layers within the magnetic core and laterally surrounding the central post. The structures include interleaved first and second sets of antiparallel-oriented C-shaped conductive layers and are driven using drive traces. The drive traces are formed from one of the C-shaped conductive layers or from conductive traces on a drive printed circuit board that underlies the stacked ceramic layers. The traces include one or more loops running around the central post. Host circuitry for the structures may have a central tap terminal coupled to the traces. If desired, a shield layer may overlap the conductive layers.