Stacked Resonator Conductor Layout for Higher Q in Compact Components
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Solution Overview
Problem
Existing electronic components face challenges in improving the Q factor while achieving downsizing, as conventional designs often compromise on either performance or size.
Innovation Solution
The electronic component is designed with conductors extending in the stacking direction of insulator layers, where one conductor's length orthogonal to the facing direction is longer than the other, allowing for increased inductance and Q factor without increasing the component's dimensions, and includes recesses on the conductor sides for improved bonding strength and reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductor dimensions are increased to improve inductance and Q factor, then the performance is improved, but the component size increases
Solution Approach 1:
The patent transitions from planar conductor arrangements to three-dimensional stacked configurations. Conductors are arranged in multiple layers with vertical connections through via holes, enabling increased inductance and Q factor by utilizing the stacking direction (height dimension) rather than expanding only in the horizontal plane. This allows performance improvement while maintaining compact footprint dimensions.
Solution Approach 2:
The patent implements nested conductor structures where conductors in different layers are positioned to form nested patterns. Inner conductors are surrounded by outer conductors in adjacent layers, creating compact nested arrangements that maximize inductance within minimal space. The via holes connecting different layers are strategically positioned within the nested structure, allowing vertical integration without increasing horizontal footprint.
2Device complexity
If via holes are used to connect conductors in the stacking direction, then three-dimensional integration is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple via holes into common via structures where adjacent via holes are merged or closely integrated. This reduces the total number of separate via formation steps and simplifies the manufacturing process. The merged via structures also improve electrical connectivity and reduce parasitic effects while maintaining the three-dimensional stacked architecture.
Solution Approach 2:
The via holes serve multiple functions simultaneously: they provide electrical connections between different conductor layers, act as structural support elements, and define the geometric arrangement of the nested conductor pattern. This multi-functionality reduces the need for separate structural support elements and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the Q factor by enlarging the conductor openings while maintaining a compact size, increasing inductance and improving bonding strength, thereby achieving better performance in a smaller form factor.
Implementation Method 1
LC resonators electromagnetically coupled by the inductors and the capacitors
Implementation Method 2
LC resonators electromagnetically coupled
Data Source
AI summary
An electronic component includes an element body and a resonator within the element body. The resonator comprises two conductors extending in a second direction and an inductor conductor connecting them. When viewed from the second direction, at least one of the conductors has a first length in a first direction that is longer than a second length in a third direction. In a graph where the horizontal axis represents the second length of the conductor and the vertical axis represents the Q factor, if X1 and X2 are values on the horizontal axis and Y1 and Y2 are corresponding Q factors on the vertical axis, the slope (Y2−Y1)/(X2−X1) is negative.