Stacked RF Component Layout for Low Height and Power Handling
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Solution Overview
Problem
Existing radio-frequency devices with a wafer level package (WLP) structure face challenges in reducing height while maintaining electric power handling performance, as thinning the substrate leads to increased substrate temperature and decreased heat capacity, limiting further size reduction in communication devices like mobile terminals.
Innovation Solution
A stack structure configuration where two devices with functional elements are positioned facing each other, sharing a space to reduce thickness without thinning the substrate, allowing for a reduction in device height while maintaining electric power handling performance, using a piezoelectric substrate with a sealing member for enhanced moisture and impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the substrate thickness is reduced to decrease device height, then the device height is reduced, but the heat capacity decreases and substrate temperature increases, leading to decreased electric power handling performance
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stack structure where devices are arranged vertically. Multiple devices are stacked in the thickness direction with functional elements facing each other across interfaces, enabling height reduction while maintaining substrate thickness and heat capacity through vertical space utilization rather than lateral compression.
Solution Approach 2:
The patent implements a nested configuration where devices are stacked such that the functional element of one device is located on a surface facing another device, and the functional element of the second device is located on a surface facing the first device. This nesting allows shared space between devices, reducing overall height while preserving individual device integrity and thermal characteristics.
2Length of stationary object
If the substrate thickness is reduced to decrease device height, then the device height is reduced, but the substrate area for forming functional elements is limited, constraining device functionality
Solution Approach 1:
The patent resolves this contradiction by moving the functional elements to different vertical levels within the stack structure. The functional element of the first device is located on a first surface facing the second device, and the functional element of the second device is located on a second surface facing the first device, utilizing the third dimension to accommodate multiple functional elements without compromising substrate area.
3Area of stationary object
If a stack structure is used to reduce substrate area, then the planar size is reduced, but the thickness direction dimension cannot be reduced further due to space requirements for resonator excitation
Solution Approach 1:
The patent merges the space requirements of multiple devices by positioning them such that they share the space between them. The functional elements are arranged to face each other across the device interface, allowing the stack structure to accommodate resonator excitation space requirements while minimizing the overall thickness through efficient spatial integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a significant reduction in device height while preventing a decrease in electric power handling performance, improving the design of radio-frequency devices by allowing for further miniaturization without compromising functionality.
Implementation Method 1
an acoustic wave device in which an acoustic wave resonator is utilized... a hollow space for mechanically vibrating the acoustic wave resonator is required
Implementation Method 2
form a piezoelectric substrate on which the acoustic wave resonator is formed
Data Source
AI summary
An electronic component includes a mounting substrate, and first and second devices each including a functional element. The first device is spaced apart from and faces the mounting substrate. The second device is located on the mounting substrate and faces the first device. A functional element of the first device is located on a first surface facing the second device, in the first device. A functional element of the second device is located on a second surface facing the first device, in the second device.