Stacked Acoustic Wave Filter Layout for RF Module Heat Dissipation

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Solution Overview

Problem

Existing radio frequency modules face challenges in improving heat dissipation properties for two transmission filters when transmitting two transmission signals capable of simultaneous communication.

Innovation Solution

A radio frequency module is designed with a mounting board, a first acoustic wave filter, a second acoustic wave filter, a first resin layer, and a first shield electrode. The first resin layer covers at least a part of both filters, and the first shield electrode covers the resin layer, enhancing heat dissipation by allowing heat from the second transmission filter to be dissipated through the first shield electrode.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If two transmission filters are stacked to enable simultaneous communication of two transmission signals, then communication capability is improved, but heat dissipation performance deteriorates

Engineering Contradiction:
Improvesimultaneous communication capabilityVSAvoidheat dissipation performance
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent divides the heat dissipation function into separate ground electrodes for each filter. The first ground electrode is connected to the first transmission filter while the second ground electrode is connected to the second transmission filter, allowing independent heat dissipation paths for each filter unit.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an insulating layer as an intermediary between the first and second ground electrodes. This insulating layer prevents harmful thermal and electrical interaction between the stacked filters while maintaining their individual ground connections, effectively mediating the heat dissipation process.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If transmission filters are stacked in a compact arrangement, then device size is reduced, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvedevice sizeVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent transitions from planar heat dissipation to three-dimensional heat dissipation by stacking filters vertically and providing separate ground electrode connections for each layer. This dimensional approach allows compact vertical integration while maintaining independent heat dissipation pathways for each filter.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the ground electrode system into multiple independent ground electrodes, each associated with a specific filter layer. This segmentation enables each filter to dissipate heat independently through its own ground connection, preventing heat accumulation in the compact stacked structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively improves the heat dissipation properties of the second transmission filter, reducing the influence of heat generated in the second filter on the first filter, thereby enhancing the overall performance of the radio frequency module.

Implementation Method 1

the first shield electrode covers at least a part of the first resin layer... allowing heat from the second transmission filter to be dissipated through the first shield electrode

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250038773A1Radio frequency module and communication device
Publication Date: 2025.01.30 MURATA MFG CO LTD
  • US20250038773A1 patent drawing
  • US20250038773A1 patent drawing
  • US20250038773A1 patent drawing

AI summary

A radio frequency module includes a mounting board, a first acoustic wave filter including a first support disposed at a first main surface of the mounting board, a second acoustic wave filter including a second support disposed on the first acoustic wave filter, and a shield electrode. The shield electrode covers at least a part of the resin layer. The first acoustic wave filter and the second acoustic wave filter pass signals to perform simultaneous communication. A main surface of the second acoustic wave filter on an opposite side from a first acoustic wave filter side is in contact with the shield electrode. A ground electrode of the mounting board is connected to a functional electrode of the first acoustic wave filter.