Stacked Acoustic Wave Filter Module for Compact RF Isolation
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Solution Overview
Problem
Existing high-frequency modules face challenges in maintaining performance characteristics while reducing size, as they tend to deteriorate with size reduction.
Innovation Solution
The high-frequency module incorporates a mounting substrate, a first chip with first acoustic wave resonators, and a second chip with second acoustic wave resonators, where the second chip is stacked on the first chip opposite to the mounting substrate side, and circuit elements related to each filter are disposed on specific surfaces of the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the high-frequency module is reduced in size, then the compactness is improved, but the characteristic deterioration occurs
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, placing the second chip on top of the first chip. This vertical stacking enables compactness in the horizontal plane while maintaining adequate separation between components through the vertical dimension, thus resolving the contradiction between size reduction and performance maintenance.
Solution Approach 2:
The patent divides the module into multiple independent chips (first chip with first filter, second chip with second filter) that can be separately manufactured and then stacked. This segmentation allows each chip to be optimized independently while achieving overall compactness through the stacked arrangement, preventing characteristic deterioration.
2Reliability
If the wiring length is shortened, then the signal transmission quality is improved, but the layout complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking chips, which dramatically shortens the wiring length between filters compared to lateral connections. The through-chip connections in the vertical direction reduce signal path length and improve transmission quality, while the standardized stacking interface manages the layout complexity.
Solution Approach 2:
The patent implements a nested structure where the second chip is positioned on top of the first chip, with wiring passing through the chips in a hierarchical manner. This nesting approach consolidates multiple connection paths into a compact vertical arrangement, shortening effective wiring length while organizing complexity in a manageable structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the suppression of characteristic deterioration while achieving size reduction, by shortening wiring lengths and improving isolation between inductive elements.
Implementation Method 1
The first chip includes at least one of a plurality of first acoustic wave resonators of a first filter
Data Source
AI summary
In a high-frequency module, a first chip includes one of a plurality of first acoustic wave resonators of a first filter a mounting substrate. A second chip includes one of a plurality of second acoustic wave resonators of a second filter. The second chip is on a side of the first chip opposite to the mounting substrate side. The first chip has a first main surface on the second chip side and a second main surface on the mounting substrate side. The second chip includes a third main surface on the first chip side and a fourth main surface on a side opposite to the first chip side. A first circuit element related to the first filter is on the second main surface side of the first chip. A second circuit element related to the second filter is disposed on the fourth main surface side of the second chip.