Stacked RF Module Layout for Power Amplifier Heat Dissipation
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Solution Overview
Problem
As radio frequency modules decrease in size, the mounting density of electronic components increases, leading to degraded radio frequency characteristics due to elevated temperatures of adjacent high-output power amplifiers.
Innovation Solution
A radio frequency module design with dual module substrates, where power amplifiers have a heat dissipation conductor joined to their main surface, and a heat dissipation conductor is also integrated into the module substrate, improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the radio frequency module is decreased, then the mounting density of electronic components increases, but the temperature of the power amplifier increases and radio frequency characteristics are degraded
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration using multiple substrates (first substrate, second substrate, third substrate) arranged in vertical layers. This dimensional change allows heat dissipation conductors to be positioned in different spatial planes, enabling effective thermal management while maintaining compact module size.
Solution Approach 2:
The patent introduces heat dissipation conductors as intermediary elements between the power amplifier and the surrounding environment. These conductors (fourth conductor on first substrate, fifth conductor on second substrate, sixth conductor on third substrate) act as thermal mediators that transfer heat away from the power amplifier, resolving the thermal accumulation problem in compact designs.
2Volume of moving object
If the size of the radio frequency module is decreased, then the mounting density of electronic components increases, but radio frequency characteristics are degraded
Solution Approach 1:
By arranging heat dissipation conductors on multiple substrates in vertical stacking (first substrate with fourth conductor, second substrate with fifth conductor, third substrate with sixth conductor), the patent creates three-dimensional thermal management pathways that maintain radio frequency performance while reducing module size.
Solution Approach 2:
The patent applies heat dissipation conductors specifically at locations adjacent to the power amplifier on each substrate, creating localized thermal management zones. This targeted approach maintains radio frequency characteristics by preventing hot spots near the power amplifier while allowing other areas to maintain their original design characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a reduced module size while enhancing heat dissipation of power amplifiers, maintaining optimal radio frequency characteristics.
Implementation Method 1
A heat dissipation conductor is joined to the fifth main surface
Implementation Method 2
improving the heat dissipation of a power amplifier
Data Source
AI summary
A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.