Stacked RF Module Layout for Shorter Interconnect Paths
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Solution Overview
Problem
In radio-frequency modules for mobile communication devices, the increasing number of supported bands leads to more complex designs, resulting in longer wiring lengths between electronic components, which can increase mismatch loss and variability.
Innovation Solution
A radio-frequency module configuration with multiple substrates, where electronic components are layered between and on the substrates, allowing components to be coupled directly or via electrodes, reducing trace lengths and improving electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple module substrates are used to reduce module size, then the module size is reduced, but the wiring lengths between electronic components are increased
Solution Approach 1:
The patent places electronic components between multiple module substrates (first, second, and third substrates) in a nested configuration. Specifically, components are positioned between the first and second substrates, and between the second and third substrates, allowing wiring to pass through the second substrate to connect components across multiple layers. This nesting approach reduces the horizontal wiring length while maintaining compact module size.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by placing electronic components between multiple substrates in the vertical dimension. The wiring passes through the second substrate to connect components on different sides, utilizing the Z-axis dimension to reduce trace lengths that would otherwise extend across the substrate surfaces.
2Adaptability or versatility
If wiring length between electronic components is increased, then more bands can be supported, but mismatch loss and variability increase
Solution Approach 1:
The patent divides the module into multiple functional substrates (first, second, and third substrates) with electronic components distributed across different locations. This segmentation allows different bands to be supported through distributed component placement while the through-substrate wiring maintains short, controlled connection paths, preserving electrical performance stability despite the increased component count for multi-band support.
Data Source
AI summary
A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.