Stacked RF Semiconductor Module Shielding for MMIC-Control IC Interference
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Solution Overview
Problem
Radio-frequency interference occurs between radio-frequency circuits in semiconductor devices, particularly between the MMIC and control IC in RF front-end modules, due to their stacked structure, which affects the performance of communication devices.
Innovation Solution
A semiconductor device with a stacking structure that includes a first member with an elemental semiconductor-based electronic circuit and a second member with a compound semiconductor-based electronic circuit, connected via an interlayer insulating film and inter-member connection wires, and a shield structure using a metal pattern to shield radio-frequency interference, with conductive protrusions coupled to the ground for effective noise suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a stacking structure is used to reduce module size, then miniaturization is achieved, but radio-frequency interference occurs between circuits
Solution Approach 1:
A shield structure comprising a metal pattern and interlayer insulating film is introduced as an intermediary between the radio-frequency circuit and other electronic circuits. The metal pattern acts as a shield to block radio-frequency interference, while the insulating film provides electrical isolation. This intermediary structure enables the stacking configuration to maintain both miniaturization and interference suppression.
Solution Approach 2:
The module is segmented into distinct functional layers with different semiconductor materials (e.g., GaAs for RF circuits, Si for control circuits) stacked vertically. By separating circuits with different interference characteristics into different layers and using the shield structure between them, the design achieves size reduction through stacking while preventing interference through material and structural segmentation.
2Adaptability or versatility
If different semiconductor materials are used in stacked circuits, then circuit functionality is improved, but manufacturing complexity increases
Solution Approach 1:
The interlayer insulating film serves multiple functions: it provides electrical insulation between different semiconductor layers, acts as a base for the metal pattern shield, and facilitates the bonding interface between stacked substrates. This multi-functionality reduces the need for additional specialized components and processes, thereby managing manufacturing complexity while enabling diverse circuit functionalities across different semiconductor material layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses radio-frequency interference between the electronic circuits, improving the performance and reducing noise transmission in RF front-end modules by using a shield structure that is integrated into the redistribution layer without adding new processes.
Implementation Method 1
a shield structure that includes a first metal pattern disposed on the interlayer insulating film and that shields a shielded circuit in terms of radio frequencies
Implementation Method 2
an inter-member connection wire disposed on the interlayer insulating film, the inter-member connection wire coupling the first electronic circuit and the second electronic circuit through an opening formed in the interlayer insulating film
Data Source
AI summary
A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.