Stacked RF Module Substrates for Compact Size and Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As radio frequency modules decrease in size, there is a concern that their transmission characteristics degrade, affecting their performance.
Innovation Solution
A radio frequency module design with a first module substrate thicker than a second module substrate, incorporating a first inductor and electronic components such as filters and switches, is used to maintain performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the radio frequency module is decreased, then the compactness is improved, but the transmission characteristics are degraded
Solution Approach 1:
The radio frequency module is divided into two separate substrates: a first substrate for mounting high-frequency components (inductors, filters, switches) and a second substrate for mounting low-frequency components (control circuits). This segmentation prevents high-frequency signal interference with low-frequency control signals, maintaining transmission characteristics while enabling compact integration of all components within a smaller overall module volume.
Solution Approach 2:
The patent transitions from a single-plane component arrangement to a three-dimensional stacked configuration with two substrates positioned at different heights. The first substrate is mounted on the upper surface of the second substrate, utilizing vertical space to reduce the horizontal footprint of the module while preserving signal integrity through controlled impedance design and proper grounding structures.
2Quantity of substance
If the size of the radio frequency module is decreased, then the integration density is improved, but the radio frequency performance of electronic components deteriorates
Solution Approach 1:
By separating high-frequency and low-frequency components onto different substrates, the patent achieves high integration density without compromising radio frequency performance. The first substrate is optimized for RF components with appropriate impedance control and grounding, while the second substrate handles control functions, allowing both to coexist in a compact package without performance degradation.
Solution Approach 2:
The first substrate is specifically designed with local optimizations for radio frequency performance, including controlled impedance traces, proper grounding structures, and component placement strategies tailored for high-frequency operation. This localized quality assurance ensures that RF components maintain their performance characteristics even in a compact integrated module.
Data Source
AI summary
A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components are disposed between the second main surface and the third main surface, on the first main surface, and on the fourth main surface. A first inductor is disposed in the first module substrate. The multiple electronic components include a first filter, and a switch that connects and disconnects an antenna connection terminal and the first filter. The first inductor is connected between the switch and the first filter. The first module substrate is thicker than the second module substrate.